Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
EVERLIGHT EL817S1(B)(TU) EL817S1
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- EVERLIGHT EL817S1(B)(TU)
- Type
- EVERLIGHT
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- EVERLIGHT
- Electronic Component
- EL817S1(B)(TU)
- Electronic Component
- 1
- Package
- SOP-4-2.54mm
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0.28g
- Electronic Component
- 1
- Electronic Component
- 3us
- Electronic Component
- BM0231071450
- Operating Temperature
- 55℃~+110℃
- Load Voltage
- 35V
- Type
- DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
- (Pd)
- 200mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EL817S1(B)(TU) 产品概述
一、产品简介
EL817S1(B)(TU) 为 EVERLIGHT（台湾亿光）出品的单通道晶体管输出光耦，输入端为直流 LED，输出端为光电三极管。器件以 SOP-4（2.54mm 引距）封装提供，适合在空间受限的电路中实现低成本、可靠的电气隔离与信号传输。
二、主要特性
- 输入类型：DC（LED 驱动）
- 输出类型：光电三极管（NPN）单通道
- LED 正向压降 Vf：1.2V（典型）
- 输出集电极电流 IC(max)：50mA
- 直流反向耐压 Vr（LED）：6V
- 输出耐压（负载电压）：35V
- 隔离耐压 Vrms：5kV（典型绝缘等级）
- 集—射极饱和电压 VCE(sat)：0.1V（测试条件：IF=20mA，IC=1mA）
- 电流传输比 CTR：最小 50%，最大可达 600%（视测试条件）
- 开关特性：上升时间 tr ≈ 4μs，下降时间 tf ≈ 3μs
- 工作温度范围：-55℃ ~ +110℃
- 最大正向电流 If：60mA（绝对最大额定）
- 总耗散 Pd：200mW（输出端功耗额定）
三、典型应用场景
- MCU 与高压侧电路之间的信号隔离
- 开关电源反馈回路（低速反馈信号）
- 工业控制信号传输、PLC 输入接口
- 电机驱动、继电器驱动器的状态检测（需注意电流与功耗限制）
- 家电与通信设备中常见的低频隔离场合
四、关键电气与热特性说明
- CTR 受驱动电流、工作温度与 VCE 影响较大，设计时应参考厂方在相同测试条件下的典型曲线以选择合适的 LED 驱动电流和上拉电阻。
- VCE(sat) 在给定测试条件下可低至 0.1V，适合要求低压降的开关场合，但当 IC 或 If 增大时饱和电压可能上升。
- 器件隔离电压为 5kVrms，但在实际安全设计中应同时遵循爬电距离和固有绝缘要求，避免仅凭 Vrms 值判断安全等级。
- 总功耗与封装散热能力相关，连续工作时应避免接近最大 Pd，同时在高温环境下进行降额设计。
五、封装与布局建议
- SOP-4（2.54mm 引距）封装便于波峰/回流焊与自动贴装。
- PCB 布局时，输入侧与输出侧应保持合适的爬电/间隙距离，并在高压侧加宽防污涂层或保持更大间距以提升可靠性。
- 输出侧如需驱动 50mA 级负载，建议在附近预留较短的走线与合适的散热路径。
六、使用提示
- 建议按照目标 CTR 与开关速度权衡 If（通常 1~20mA 范围内）以获得稳定的输出响应。
- 对于数字信号隔离，配合适当的上拉电阻可稳定输出电平；对模拟或慢速反馈信号注意滤波与带宽限制。
- 在高湿、高污染环境下，应加强封装保护或采用涂层以防表面泄漏影响隔离性能。
EL817S1(B)(TU) 在低成本、可靠隔离与中低速信号传输场合表现良好，设计时注意按照上述电气与热限制进行降额设计与合理布局，可获得长期稳定的隔离传输效果。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
