Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
EVERLIGHT EL851S1(TU) EL851S1
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- EVERLIGHT EL851S1(TU)
- Type
- EVERLIGHT
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- EVERLIGHT
- Electronic Component
- EL851S1(TU)
- Electronic Component
- 1
- Package
- SMD-4P
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0.47g
- Electronic Component
- 1
- Electronic Component
- 5us
- Electronic Component
- BM0000038265
- Operating Temperature
- 55℃~+100℃
- Load Voltage
- 350V
- Type
- DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
- (Pd)
- 200mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EL851S1(TU) 产品概述
EL851S1(TU) 是来自台湾亿光(EVERLIGHT)的一款高性能晶体管输出光耦合器。该产品通过光电三极管和发光二极管的组合设计，提供了高效的电气隔离功能，适用于多种数字和模拟信号的传输。这种光耦合器具有出色的性能，在多种电子应用中得到了广泛的应用。
1. 产品特性
光电隔离
EL851S1(TU)利用内部LED和光电三极管实现信号的光电隔离，能够有效阻断高电压，对下游电路提供保护，防止噪声和干扰的影响。其共模抑制比(CMVR)高达80kV/µS，确保信号传输的稳定性和可靠性。
的输出特性
该光耦的输出光电三极管具有50mA的最大输出电流能力，适用于大部分控制和驱动应用。其输出电压范围在1.2V时可保证最佳性能，具有良好的线性特性，适合在多种电源条件下工作。
封装设计
EL851S1(TU)采用SMD（表面贴装）封装，尺寸紧凑，适合自动化生产及空间有限的电路设计。这种封装形式使其在PCB布局中更加灵活，尤其适合现代消费电子和工业控制设备。
2. 应用领域
EL851S1(TU)的广泛应用可涵盖以下几个领域：
家庭自动化
在智能家居设备中，光耦合器可用于电灯、空调等设备的保护和控制，同时为微控制器和传感器提供有效的电气隔离。
工业控制
该产品在工业自动化设备中应用极为广泛，通常用于信号传输、电机控制、PLC (可编程逻辑控制器) 输入输出接口等地方，为复杂的控制系统提供安全稳定的信号传输。
电源管理
EL851S1(TU)在开关电源设计中，也扮演着至关重要的角色。其确保高压侧和低压侧之间的安全隔离，保护下游电路不受电源故障造成的影响。
通信设备
在网络和通信设备中，光耦合器用于数据传输链路，以实现各模块之间的隔离，有效提高系统的抗干扰性能和稳定性。
3. 性能规格
- 输入电流: 20mA (典型值)
- 输出电流: 50mA (最大值)
- 工作温度范围: -40°C 至 +100°C
- 传输延迟时间: 10µs (典型值)
- 共模抑制比: 80kV/µS
4. 结论
作为一款高性能的光耦合器，EL851S1(TU)不仅支持多种工作环境，还能够满足现代电子设备对信号传输和电气隔离的严苛要求。无论是在智能家居、工业控制还是通信设备中，EL851S1(TU)都能为设计师提供可靠的解决方案。其优秀的性能和灵活的应用性，使得其在当前市场中具备了相当的竞争力。
通过选择EL851S1(TU)，企业和设计师可以减少系统故障的风险，提升产品的稳定性与可靠性，为客户提供更优质的电子解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
