WMSIC Electronic Components

EVERLIGHT 67-21/G6C-FN2P2B/2T 67-21

Model67-21/G6C-FN2P2B/2T
PackageSMD3528-2P
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
EVERLIGHT 67-21 / G6C-FN2P2B / 2T
Type
EVERLIGHT
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Power
60mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
67-21/G6C-FN2P2B/2T
Electronic Component
1
Package
SMD3528-2P
Electronic Component
572nm
Electronic Component
LEDDiode / LED
Electronic Component
0.054g
Electronic Component
1
LED
54mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0257687572
Electronic Component
575nm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

67-21/G6C-FN2P2B/2T 产品概述

一、产品简介

67-21/G6C-FN2P2B/2T 是 EVERLIGHT(台湾亿光)系列黄绿色表面贴装指示 LED,透镜为无色透明,适用于面板指示、状态显示和一般光源提示等场合。该器件在标准驱动电流 20 mA 条件下表现出良好的光电特性与宽视角分布,便于在可视性与布板空间之间取得平衡。

二、主要性能参数

  • 发光颜色:黄绿色
  • 峰值波长:575 nm
  • 波长(典型):572 nm
  • 正向电压(Vf):2.05 V(在 IF = 20 mA)
  • 额定正向电流:20 mA(最大额定驱动电流)
  • 功率:60 mW(额定)
  • 发光强度:54 mcd(在 IF = 20 mA)
  • 发光角度:120°(典型)
  • 透镜颜色:无色透明透镜
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 包装与封装:2PLCC SMD 标准封装(具体外形尺寸与焊盘建议请以厂方数据表为准)

三、光学与电气特性说明

  • 色域与光谱:575 nm 峰值位于黄绿色波段,视觉上偏黄绿色,适合作为高可见度指示灯。572 nm 的典型波长与峰值相近,波长一致性适合色彩匹配应用。
  • 光强:54 mcd(20 mA)在 120° 的宽视角下,能为近距离观察或大视角面板指示提供均匀亮度。若需要更强的远距可视性,可通过串并联多颗或增加驱动电流(需在安全范围并考虑散热)实现。
  • 电气:在 20 mA 时 Vf ≈ 2.05 V,耗散功率约为 Vf × IF = 2.05 V × 0.02 A = 0.041 W(41 mW),低于器件额定功率 60 mW,留有余量有利于长期可靠性。

示例限流电阻(典型计算):

  • 5 V 电源:R = (5.00 − 2.05) / 0.02 ≈ 148 Ω → 推荐 150 Ω,电阻耗散约 0.06 W,选 0.125 W 或 0.25 W 品级。
  • 3.3 V 电源:R = (3.30 − 2.05) / 0.02 ≈ 62.5 Ω → 推荐 62 Ω 或 68 Ω,电阻耗散约 0.03 W,0.125 W 足够。
  • 12 V 单灯:R = (12 − 2.05) / 0.02 ≈ 498 Ω → 推荐 500 Ω,电阻耗散约 0.20 W,建议 0.5 W 电阻或采用串联多颗 LED 的方式以降低电阻发热。

四、热管理与可靠性

  • 工作温度范围 -40 ℃ ~ +85 ℃,适用于工业与消费类产品常见温度环境。
  • 虽然单颗 LED 的耗散功率较低(典型 41 mW),在密集布板或封装受限的环境下仍需关注热累积。推荐在高温环境或连续点亮场景下做电流降额处理或增加散热路径(铜箔面积、散热片等)。
  • 建议按照厂方的寿命与应力测试数据进行可靠性评估,长期驱动接近或超过额定电流会显著影响光衰和寿命。

五、封装与安装建议

  • 封装类型为 2PLCC SMD,适合自动贴装与回流焊工艺。具体焊盘尺寸、顶视与侧视外形请参考厂方工程图与 PCB 焊盘推荐。
  • 回流焊建议遵循 JEDEC/J-STD-020 的无铅回流曲线,并按厂方给出的最高回流温度和时间限制执行,以防透镜变色或内部结构损伤。
  • 取放与贴装过程中注意 ESD 防护与避免机械挤压透镜。焊接后建议进行外观检查与功能测试。

六、典型应用场景

  • 面板与设备状态指示(电源、通信、故障灯)
  • 工业控制器与测试仪表的视觉提示
  • 家电与消费电子的功能指示(如充电指示、连接状态)
  • 一般照明点光源或背光应用(需评估亮度与色容差)

七、选型与采购建议

  • 在量产前请获取并核对原厂完整数据手册(包括 IV 曲线、光衰曲线、回流焊曲线、机械尺寸图与焊盘建议)。
  • 如需不同亮度等级、不同封装或水晶透镜/扩散透镜版本,可联系代理商或厂方获得替代产品信息。
  • 对环境合规(RoHS、环境测试)或特殊认证(例如汽车级 AEC-Q)有要求的项目,请务必向供应链确认该型号的合规状态与对应证书。

以上为 67-21/G6C-FN2P2B/2T 的技术概览与工程建议。欲获取完整电气/光学曲线与机械图纸,请参照 EVERLIGHT 正式数据手册或联系厂商技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.