WMSIC Electronic Components

EVERLIGHT EL3021S(TA) EL3021S

ModelEL3021S(TA)
PackageSMD-6P
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
EVERLIGHT EL3021S(TA)
Type
EVERLIGHT
Unit
Electronic Component
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
EL3021S(TA)
Electronic Component
1
Package
SMD-6P
Electronic Component
Thyristor Output Optocoupler
Electronic Component
1g
Electronic Component
1
Channel Count
1
Staticdv / dt
100V/us
Electronic Component
BM0228737428
Operating Temperature
55℃~+100℃
Current
60mA
Load Voltage
400V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EL3021S(TA) 产品概述

一、产品简介

EL3021S(TA) 为台湾亿光(EVERLIGHT)出品的单通道可控硅输出光耦(光电隔离三极可控硅/双向可控硅)。器件采用 SMD-6P 封装,内部由发光二极管驱动双向可控硅输出,实现输入与高压交流侧之间的电气隔离。该器件不带过零功能(随机触发),适用于需要相位控制或任意相位触发的交流负载控制场合。

二、主要性能参数

  • 可控硅类型:双向可控硅(Triac 输出,双向导通)
  • 过零功能:无(随机相触发)
  • 输出导通压降 (Vf):约 1.18 V(导通状态时三极可控硅两端电压)
  • 隔离电压:5 kVrms(输入与输出间耐压能力)
  • 输出电流:60 mA(可控硅允许的最大负载电流)
  • 允许负载电压:最高 400 V
  • 静态 dv/dt:100 V/μs(对误触发敏感度的静态耐受)
  • 通道数:1 通道
  • 工作温度范围:-55 ℃ 至 +100 ℃
  • 封装形式:SMD-6P

三、产品特点与优势

  • 高隔离电压(5 kVrms),适合需要高电压隔离的工业及家电控制场景。
  • 随机相触发(无过零),便于实现调光、调压等相位控制应用。
  • 低导通电压(约 1.18 V),导通损耗小,有利于热管理。
  • 紧凑的 SMD-6P 封装,适合表面贴装工艺与自动化生产。
  • 宽工作温度范围,可靠性高,适应恶劣环境。

四、典型应用场景

  • 小功率交流负载的相位控制:调光器、风扇速度控制等。
  • 智能家电与白色家电中的隔离开关控制(小电流指示灯、信号采集)。
  • 工业控制系统中微功率负载的光电隔离与触发。
  • 作为固态继电器、光隔离触发模块的一部分,用于保持输入与交流侧的安全隔离。

五、设计与使用建议

  • 驱动与触发:因为器件为随机触发型,设计时应保证输入 LED 的驱动电流和持续时间符合原厂 Datasheet 要求,以确保可靠触发。
  • dv/dt 管理:器件的静态 dv/dt 为 100 V/μs,遇到高 dv/dt 的快速开关或感性负载时建议并联 RC 抑制(或使用额外的 snubber)以防止误触发。
  • 负载匹配:输出允许电压最高至 400 V,电流上限 60 mA,适合小电流交流负载。对于较大电流或感性/容性负载,请选用额定更高的器件或并联合适保护电路。
  • PCB 布局:为维持 5 kVrms 的隔离性能,注意输入与输出之间的爬电距离与气隙,以及波峰/焊盘的绝缘处理。SMD 封装在回流焊后请按厂方建议做干燥与存储处理(MSL)。
  • 热管理:虽为小电流器件,但在高温或长时间导通条件下应注意封装温升并做必要的布局与散热设计。

六、采购与替代建议

  • 型号与封装:EL3021S(TA),SMD-6P,TA 后缀通常表示卷带包装(详情以供货描述为准)。
  • 选型注意:若应用需要过零触发、承载更大电流或更高 dv/dt 抗扰度,可考虑对应的过零型或高电流光耦替代产品。购买与设计前建议下载并详细阅读亿光原厂 Datasheet,确认所有绝对最大额定值与典型电气特性。

总结:EL3021S(TA) 以其高隔离电压、随机相触发和紧凑 SMD 封装,适合小功率交流负载的安全隔离与相位控制场合。为保证可靠性,请严格按 Datasheet 推荐的驱动条件、热与隔离设计进行系统集成。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.