WMSIC Electronic Components

EVERLIGHT EL1012(TA)-VG EL1012

ModelEL1012(TA)-VG
PackageSOP-4-2.54mm
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
EVERLIGHT EL1012(TA)-VG
Type
EVERLIGHT
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
EL1012(TA)-VG
Electronic Component
1
Package
SOP-4-2.54mm
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.264g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0226513118
Operating Temperature
55℃~+110℃
Output Current
50mA
Output Channel Count
1
(tr)
2us
(Vf)
1.45V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EL1012(TA)-VG — EVERLIGHT(亿光)晶体管输出光耦产品概述

一、概述

EL1012(TA)-VG 为台湾 EVERLIGHT(亿光)出品的一款单通道晶体管输出光耦,采用 SOP‑4(2.54 mm)封装,内部为 LED 驱动光电晶体管,提供高隔离性能与工业级温度范围。该器件适用于把低压控制信号与高压/噪声侧电路进行电气隔离的常见场景,如工业控制接口、传感器隔离、微控制器与电源/驱动模块之间的信号隔离等。

二、主要参数亮点

  • 隔离电压(Vrms):5 kV,适用于较高电压隔离需求
  • 工作温度:-55 ℃ ~ +110 ℃,满足工业级环境要求
  • 正向压降(Vf,LED):1.45 V(典型)
  • 输出电流:50 mA(最大)
  • 上升/下降时间:tr = 2 μs,tf = 3 μs,属于中速响应类型
  • 输出通道数:1 通道,封装 SOP‑4(引脚间距 2.54 mm)

三、性能分析与适用场景

  • 隔离与安全:5 kV 隔离能力在功能隔离和许多工业应用中具备良好安全裕度,可有效阻断高压干扰。
  • 温度与可靠性:-55℃~+110℃ 的工作范围适合严苛环境及长期运行。
  • 速度特性:tr/tf 在微秒级,估算带宽约在十万至二十万赫兹量级,适合数字信号传输、脉冲信号及开关控制,但不适合高速串行总线(如高速 UART、USB 等高比特率场景)。
  • 驱动能力:最大 50 mA 的输出能力能直接驱动低功耗负载或作为中间级放大,但若长期工作接近极限,应关注功耗与散热。

四、使用建议与电路实例

  • LED 驱动电阻计算(示例):若驱动电源为 5 V,目标 LED 驱动电流 If = 10 mA,则 R = (5 − Vf) / If = (5 − 1.45) / 0.01 ≈ 355 Ω,可选 360 Ω。
  • 集电极上拉选择:若用于 TTL/CMOS 逻辑接口,可用 4.7 kΩ 作上拉以减少静态功耗;若需更快响应或拉升更强,可使用 1 kΩ − 2.2 kΩ,但要确保输出电流与 VCE(sat) 在安全范围内。
  • 开关频率与负载:避免在接近 50 mA 的输出电流下频繁高频切换,以降低热应力与提高寿命。

五、封装与 PCB 布局建议

  • SOP‑4 封装体积小、引脚间距 2.54 mm,便于常规手工焊接或波峰/回流焊。
  • 布局时请在输入侧与输出侧间保持足够的爬电距离/气隙,结合 PCB 的爬电距离设计(建议根据具体工作电压和法规要求放宽间距);若用于高压侧,考虑加大隔离走线并避免在隔离区布置金属层。
  • 对于高 EMC 环境,建议在 LED 引脚并联去耦电容/RC 滤波以抑制上升沿毛刺,同时在输出侧按需加入 RC 抑制和 TVS 等保护器件。

六、可靠性与环境适应性

  • 器件的工作温度范围与高隔离电压使得 EL1012(TA)-VG 适合在宽温度与电磁干扰环境下长期工作。
  • 在实际应用中应关注最大反向电压、峰值电流及封装散热能力,必要时对热量做评估或采取降额使用以提升长期可靠性。

七、选型与注意事项

  • 在选型前请参考完整规格书,确认关键参数如 CTR、VCE(sat)、最大正向电流 If(max)、响应时间典型/最大值及绝对最大额定值。
  • 若应用对速度、线性或长期稳定性有更高要求,可考虑速度更快或带电流放大特性的隔离器件。
  • 采购时注意封装版本(SOP‑4)与管脚排列以避免接线错误。

总结:EL1012(TA)-VG 是一款面向工业与通用隔离信号传输的中速晶体管输出光耦,兼顾隔离性能与结构紧凑,适合作为微控制器—高压侧之间的可靠隔离元件。选用时请结合具体电流、速度及环境要求,并参照完整版数据手册完成详细电路与 PCB 设计。

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