WMSIC Electronic Components

EVERLIGHT 15-21/G6C-FM1N2B/3T 15-21

Model15-21/G6C-FM1N2B/3T
Package1206
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EVERLIGHT 15-21 / G6C-FM1N2B / 3T
Type
EVERLIGHT
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
15-21/G6C-FM1N2B/3T
Electronic Component
1
Package
1206
Electronic Component
570nm~574.5nm
Electronic Component
LEDDiode / LED
Electronic Component
0.017g
Electronic Component
1
LED
18mcd~45mcd
LED
130°
LED
Electronic Component
Electronic Component
BM0264380166
Electronic Component
575nm
Operating Temperature
40℃~+85℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EVERLIGHT 15-21/G6C-FM1N2B/3T(1206)产品概述

15-21/G6C-FM1N2B/3T 是台湾亿光(EVERLIGHT)推出的贴片发光二极管,属于1206封装的黄绿色指示灯类器件。该型号以色彩纯正、发光效率稳定和宽视角为主要特点,适用于多种面板指示、背光及小型指示照明场合。

一、主要电光参数

  • 发光颜色:黄绿色
  • 峰值波长:约575 nm(典型)
  • 波长范围:570 nm ~ 574.5 nm(光谱对应黄绿色区域)
  • 正向压降(Vf):1.75 V ~ 2.35 V
  • 发光强度:18 mcd ~ 45 mcd(取决于驱动电流与测量条件)
  • 发光角度:130°(宽视角设计)
  • 透镜颜色:无色透明(提高亮度与均匀性)
  • 工作温度:-40 ℃ 至 +85 ℃

二、封装与外形

  • 封装类型:1206 贴片(约3.2 mm × 1.6 mm),适配常见SMD贴装工艺。
  • 透镜为无色透明材料,出光面平整,便于高密度PCB布局与自动化贴装。

三、应用场景

  • 面板指示灯、状态指示(电源、故障、工作状态)
  • 仪器仪表和家电指示
  • 背光点亮与装饰性照明
  • 小型信号灯和消费电子指示模块

四、驱动与使用建议

  • 常用驱动电流通常为10–20 mA,以兼顾亮度与寿命(具体电流应参照实际设计与可靠性要求)。
  • 简单限流电阻计算:R = (Vsup − Vf) / I,例:若选定驱动电流I为20 mA,应按最大Vf取值计算以保证稳健性。
  • 长期稳定工作时建议采用恒流驱动或加入适当热管理设计以减少因温度变化带来的亮度漂移。

五、装配与可靠性提示

  • 推荐采用回流焊工艺贴装;回流焊温度曲线应遵循器件与贴片工艺规范(详见厂商数据手册)。
  • 注意防静电(ESD)防护与湿度敏感等级(MSL)管理,避免在不当储存或焊接条件下产生失效。
  • 在高温或高湿环境下应评估光输出衰减与颜色漂移,必要时进行老化筛选。

六、选型优势与注意事项

  • 优势:色点稳定、视角宽、封装小巧、适配自动化贴装,适合要求空间紧凑且需明显视觉识别的应用。
  • 注意:请根据具体使用电流与环境温度选择匹配的驱动方式,若对色容差、显色性或高亮度有严格要求,建议索取样品或参照亿光完整数据手册进行评估。

如需进一步的电气特性曲线、热阻、包装信息或回流曲线,请参考亿光官方数据手册或联系供应商获取完整技术资料与验证样品。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.