Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
EVERLIGHT EL3053S1(TA)-V EL3053S1
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- EVERLIGHT EL3053S1(TA)-V
- Type
- EVERLIGHT
- Unit
- Electronic Component
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- EVERLIGHT
- Electronic Component
- EL3053S1(TA)-V
- Electronic Component
- 1
- Package
- 6-SMD
- Electronic Component
- Thyristor Output Optocoupler
- Electronic Component
- 1g
- Electronic Component
- 1
- Channel Count
- 1
- Staticdv / dt
- 1000V/us
- Features
- positions
- Electronic Component
- BM0258756570
- Operating Temperature
- 55℃~+100℃
- Current
- 60mA
- Load Voltage
- 600V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EL3053S1(TA)-V 产品概述
一、产品简介
EL3053S1(TA)-V 是 EVERLIGHT（台湾亿光）推出的一款单通道双向可控硅光耦合器（Triac Optoisolator），采用 6-SMD 封装，内部由发光二极管（LED）驱动双向可控硅输出，能在输入侧与高压交流负载之间提供高达 5kVrms 的光电隔离。器件设计用于在交流控制场景下实现低功耗、可靠的信号传输与隔离。
二、主要电气参数
- 可控硅类型：双向可控硅（TRIAC）
- LED 正向压降 (Vf)：1.18V（典型值）
- LED 允许正向电流：最高 60mA（请按应用选择适当工作电流）
- 输出可承受负载电压：600V（VDRM/VRRM 等级）
- 隔离耐压：5kVrms（输入与输出之间）
- 静态 dv/dt：1000V/μs（对抗误触发能力的指标）
- 通道数：1 通道
- 工作温度范围：-55℃ 至 +100℃
三、典型应用场景
- 交流电机、灯光及调光器的零电压或相位控制
- 家电控制（洗衣机、空调、微波炉等）中的隔离驱动
- 工业自动化中对高压交流信号的隔离检测与驱动
- 需要小外形、SMD 贴片封装的紧凑 PCB 设计
四、设计与使用建议
- 驱动 LED 时若使用逻辑电平（如 5V），建议将工作电流设计在 10–25mA 区间以平衡触发可靠性与寿命。例如以 20mA 为目标，限流电阻 R ≈ (VCC − Vf) / IF = (5 − 1.18) / 0.02 ≈ 191Ω，可选 180Ω~220Ω。切勿直接在最大 60mA 下长期工作，除非热设计允许。
- 对于高 dv/dt 应用（电网扰动或快速换相负载），1000V/μs 为器件静态抗干扰能力参考。若环境 dv/dt 更高，建议在输出端并联 RC 抑制网络或使用 snubber 电路以降低误触发风险。
- 虽然器件内部隔离达 5kVrms，PCB 设计仍须保持合适的爬电距离与间隙，满足系统安全要求并配合相应的绝缘材料与封装策略。
- 6-SMD 封装便于自动贴装，注意焊接温度曲线和回流规范，避免影响器件可靠性。
- 工作温度范围为 -55℃～+100℃，在高温环境需关注热降额并保证散热路径合理。
五、选型与注意事项
- 若负载电压或电网电压超过 600V，需选用更高耐压等级的器件或并联系统级保护。
- 对于对安全标准有严格要求的产品，请在系统设计时核实整机认证与安规需求，器件耐压仅为元件级别指标，不等同于完整系统的安全认证。
EL3053S1(TA)-V 适合用于需要小型化、高隔离以及可靠触发的交流隔离控制场景，在正确的电流、散热与抗干扰设计下，可以为家电与工业控制等应用提供稳定的光电隔离与开关功能。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
