WMSIC Electronic Components

EVERLIGHT ELM600(TA) ELM600

ModelELM600(TA)
PackageSOP-5
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EVERLIGHT ELM600(TA)
Type
EVERLIGHT
Minimum package
3500

Technical parameters

Electronic Component
EVERLIGHT
Electronic Component
ELM600(TA)
Electronic Component
1
Package
SOP-5
Electronic Component
Logic Output Optocoupler
Electronic Component
0.22g
Electronic Component
1
Channel Count
1
Electronic Component
10Mbps
Electronic Component
BM0227655365
Operating Temperature
40℃~+85℃
Type
DC
Power Dissipation(Pd)
100mW
tp HL
100ns
tp LH
100ns
Electronic Component
3500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ELM600(TA) 产品概述

一、产品简介

ELM600(TA) 是台湾 EVERLIGHT(亿光)推出的一款单通道逻辑输出光耦,采用 SOP-5 封装,面向需要电气隔离且与数字逻辑直接接口的应用场景。该器件以低功耗、抗干扰和宽工作温度为特点,适合在工业控制、通信接口及嵌入式系统中实现输入侧与输出侧的安全隔离与信号传输。

二、主要规格(概要)

  • 输入类型:DC 驱动(LED)
  • 隔离电压(Vrms):3.75 kV
  • 传输速率:最高 10 Mbps
  • 通道数:1 通道
  • 工作温度:-40 ℃ ~ +85 ℃
  • 传播延迟:tpLH ≈ 100 ns,tpHL ≈ 100 ns
  • 输入阈值电流(FH):5 mA
  • 耗散功率(Pd):100 mW
  • 封装:SOP-5(标准表面贴装封装)
  • 品牌:EVERLIGHT(亿光)

三、关键特性与优势

  • 高隔离等级:3.75 kV 的隔离能力可有效阻断高压干扰,保护低压控制侧电路安全。
  • 快速响应:典型传播延迟约 100 ns,对应的有效带宽支持最高约 10 Mbps 的数字信号传输,适合多数工业与通信控制速率。
  • 宽温区与低功耗:-40 ℃ 至 +85 ℃ 的工作范围与约 100 mW 的低耗散功率,满足恶劣环境与长期可靠性需求。
  • 单通道小封装:SOP-5 小体积利于 PCB 布局和密集安装。

四、典型应用场景

  • 工业控制接口隔离(MCU 与高压设备之间)
  • UART、TTL、SPI 等数字接口的隔离保护
  • 电源管理与监控信号隔离
  • 需要 EMI 抑制和共模噪声隔离的测量系统

五、设计与选型要点

  • 输入驱动:根据器件的输入阈值(IFH = 5 mA)设计 LED 串联电阻。示例:若驱动电压为 5 V,假设 LED 正向压降约 1.2 V,则 R ≈ (5 V − 1.2 V) / 5 mA ≈ 760 Ω,常用 750 Ω 或 820 Ω。
  • 输出接口:ELM600 为逻辑输出光耦,具体输出结构(开路集电极或推挽)请参照原厂数据手册;若为开路输出,则需在输出侧加上适当上拉电阻以匹配所需逻辑电平与上拉电流。
  • 时序考虑:传播延迟约 100 ns,应在高速通信与脉冲精度场合进行系统时序预算,确保满足总延迟和抖动要求。
  • 功耗与散热:Pd 为 100 mW,布局时预留足够的散热路径与焊盘面积,避免长期功耗导致温度上升影响可靠性。

六、封装与可靠性

SOP-5 常用封装方便自动贴装与焊接,适合批量生产。器件通过一定等级的隔离电压测试,适用于需要电气隔离的信号链路。推荐在实际项目中参考厂家完整可靠性与寿命测试报告,以满足特定行业的认证需求。

七、使用建议与注意事项

  • 在设计前务必查阅原厂完整数据手册,确认输出结构、电压等级与引脚定义。
  • 输入端避免长时间大电流驱动,遵循 IF 规范以延长器件寿命。
  • 系统设计中同时考虑共模抑制、接地策略与 PCB 隔离,发挥光耦隔离优势。
  • 大信号速率或严苛温度条件下,进行实际板级验证以确认信号完整性与可靠性。

如需进一步的引脚定义、典型电路图和完整电气特性曲线,可提供原厂数据手册以便深入分析与工程设计参考。

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