Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
EVERLIGHT PT12-21C/TR8 PT12
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- EVERLIGHT PT12-21C / TR8
- Type
- EVERLIGHT
- Unit
- Electronic Component
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- EVERLIGHT
- Electronic Component
- PT12-21C/TR8
- Electronic Component
- 1
- Package
- SMD-3P,3x1mm
- Electronic Component
- Phototransistor
- Electronic Component
- 0.03g
- Current
- 100nA
- Electronic Component
- 1
- Electronic Component
- BM0213681586
- Electronic Component
- 940nm
- Operating Temperature
- 25℃~+85℃
- Transistor Type
- NPN
- Power Dissipation(Pd)
- 75mW
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PT12-21C/TR8 产品概述
制造商与背景
PT12-21C/TR8是由台湾亿光电子（Everlight Electronics Co., Ltd.）制造的一款红外光传感器。作为全球领先的光电元件制造商之一，亿光专注于创新和高性能的光电解决方案。其产品广泛应用于消费电子、汽车、通讯和工业设备等多个领域。
产品基本信息
PT12-21C/TR8是一种940nm波长的红外光传感器，采用表面贴装（SMD）技术并具有直角可视方向设计。其封装类型为2-SMD，无引线，便于在不同的电路板上安装使用。该产品在-25°C到85°C的环境温度范围内工作，确保在各种工作环境中均能稳定运行。
产品特点
波长特性：PT12-21C/TR8的波长为940nm，属于近红外范围，适合用于红外遥控、活动检测、以及安全和安防系统等应用。该波长具有良好的光穿透能力，特别适用于夜间或低光照条件下的工作环境。
集电极电流与击穿电压：最大集电极电流（Ic）为50mA，能够有效驱动合适的负载。而其集射极击穿电压（Vce）最高可达30V，显示出良好的抗压能力，为电路设计提供了更大的灵活性和安全性。
暗电流特性：PT12-21C/TR8的最大暗电流（Id）仅为100nA，表明该传感器在没有光照时几乎不会产生误动作，提高了传感器的可靠性及测量精度。
功率特性：该传感器的最大功率为75mW，这使得它在大多数应用中都能够高效地运行，并追求更长的使用寿命。
安装便捷性：采用表面贴装方式的封装设计，使得该传感器易于在自动化生产线上进行快速安装。同时，直角侧视角的设计也有利于应用于空间受限的产品设计中。
应用场景
PT12-21C/TR8的应用范围广泛，主要包括但不限于：
消费电子：例如遥控器、智能家居产品、电视机和音响设备中，以提高用户体验和控制精度。
安防系统：在各种监控和安全系统中，能够有效进行人员检测和活动监测。
工业自动化：可被用作检测信号和位置的传感器，大幅提升机器的智能化水平。
医疗设备：在一些非接触式测量与监测装置中，发挥重要作用。
汽车应用：适用于自动驾驶系统、泊车辅助及其他先进驾驶辅助系统。
总结
PT12-21C/TR8是一款高性能的940nm红外光传感器，凭借其出色的电流特性、良好的环境适应性及低能耗特性，成为各种应用场景下的理想选择。作为亿光电子的一款重要产品，它不仅满足了现代电子产品对性能与能效的双重需求，同时也由于其便捷的安装方式和强大的功能，推动了智能化技术的进一步发展。在快速发展的科技时代中，更符合用户需求的产品将引领未来市场的发展方向。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
