WMSIC Electronic Components

EVERLIGHT 19-21SYGC/S530-E4/4T 19-21SYGC

Model19-21SYGC/S530-E4/4T
PackageSMD,1.6x0.8mm
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EVERLIGHT 19-21SYGC / S530-E4 / 4T
Type
EVERLIGHT
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
19-21SYGC/S530-E4/4T
Electronic Component
1
Package
SMD,1.6x0.8mm
Electronic Component
573nm
Electronic Component
LEDDiode / LED
Electronic Component
0.023g
Electronic Component
1
LED
27mcd~36mcd
LED
100°
LED
Electronic Component
Electronic Component
BM0225731144
Electronic Component
575nm
Operating Temperature
40℃~+85℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

19-21SYGC/S530-E4/4T 产品概述

一、产品简介

19-21SYGC/S530-E4/4T 是 EVERLIGHT(台湾亿光)出品的一款高可靠性贴片发光二极管(SMD),封装尺寸为 1.6 x 0.8 mm(常见 0603 类封装)。发光颜色为黄绿色(视觉接近 573 nm),峰值波长 575 nm,适用于空间受限且要求颜色稳定的小型指示与背光应用。

二、主要光电参数

  • 发光颜色:黄绿色
  • 峰值波长:575 nm;典型波长:573 nm
  • 正向压降(Vf):1.7 V ~ 2.4 V
  • 发光强度:27 mcd ~ 36 mcd(视角与测量条件有关)
  • 发光角度:100°(半强度角)
  • 透镜颜色:无色透明
  • 工作温度:-40 ℃ ~ +85 ℃

三、封装与外观

该器件为 SMD 贴片型,尺寸 1.6 x 0.8 mm,透明无色透镜利于颜色纯净与外观一致性。封装适合高速贴装与回流焊工艺,适配微型电子产品的指示灯、面板灯和微型背光。

四、典型应用

  • 消费电子指示(手机、可穿戴设备、遥控器)
  • 仪表与面板指示灯
  • 医疗与测量设备的状态显示
  • 小型装饰照明与信号灯

五、使用与焊接建议

  • 驱动电流:常见驱动范围为 1 mA ~ 20 mA,实际工作点应参考产品数据手册并进行热降额设计。
  • 热管理:虽为小功率器件,但在高占空比或高环境温度下需考虑热量累积,避免长期超温工作。
  • 焊接工艺:推荐采用标准回流焊流程,遵循 JEDEC/IPC 指南;避免长时间在过高温度下曝露以防透镜或芯片应力。
  • 贴装注意极性,参照厂商封装图确定正负极位置。
  • ESD 与静电保护:搬运与装配过程中应采取静电防护措施,避免因静电击穿导致失效。

六、可靠性与存储

  • 工作与储存温度范围宽(-40 ℃ ~ +85 ℃),适应工业级环境。
  • 建议按厂商提供的湿敏等级(MSL)与包装说明进行储存管理,必要时烘烤以消除吸湿。
  • 建议在设计时考虑电流与温度的降额以延长使用寿命并保证光通维持。

七、选型与采购建议

在选型时建议参考 EVERLIGHT 官方数据手册以获取完整的光学曲线、机械尺寸图、分档(binning)信息及推荐焊接曲线。订购时确认色温/色坐标分档、发光强度等级及封装带卷规格,以便实现批次间一致性。

如需将该器件用于量产,建议先进行样片测试(含热老化、振动与焊接可靠性测试),并依据实际应用对驱动与散热进行优化设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.