WMSIC Electronic Components

EVERLIGHT PT908-7C(BIN4) PT908

ModelPT908-7C(BIN4)
PackageThrough-hole, L=4.5mm
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EVERLIGHT PT908-7C(BIN4)
Type
EVERLIGHT
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
PT908-7C(BIN4)
Electronic Component
1
Package
Through-hole, L=4.5mm
Electronic Component
Phototransistor
Electronic Component
0.318g
Current
100nA
Electronic Component
1
Electronic Component
BM0228737423
Electronic Component
860nm
Operating Temperature
25℃~+85℃
Transistor Type
NPN
Power Dissipation(Pd)
75mW
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EVERLIGHT PT908-7C(BIN4) 红外接收管 产品概述

一、主要特点

PT908-7C(BIN4) 是台湾亿光(EVERLIGHT)出品的通孔红外光敏晶体管,采用 NPN 结构,针对 860nm 附近的红外光具有良好响应。器件灵敏、暗电流低,适合短距离红外检测与开关应用(如遥控接收、对射/反射传感、编码器与光电隔断等)。封装为插件式,管长 L = 4.5mm,便于手工与波峰/通孔工艺组装。

二、关键参数

  • 晶体管类型:NPN 光敏晶体管
  • 峰值波长:860 nm(对常见红外 LED 波长匹配良好)
  • 集-射极击穿电压 Vceo:30 V(推荐不超过该值)
  • 最大集电极电流 Ic:20 mA(器件极限,应按照功耗限制使用)
  • 功耗耗散 Pd:75 mW(Pd = Vce × Ic,不可超过)
  • 暗电流:100 nA(无光时漏电小,有利于高灵敏度/高阻抗电路)
  • 工作温度范围:-25 ℃ 至 +85 ℃
  • 封装:插件(L = 4.5 mm)
  • 品牌:EVERLIGHT(亿光)

三、典型应用场景

  • 红外遥控与接收模块(与 850–940 nm 红外 LED 配合)
  • 光电开关、反射/对射式微小物体检测
  • 旋转编码器、限位检测与光学编码识别
  • 非接触测距(短距离)与安全检测电路

四、使用与设计要点

  1. 功耗与电流限制:器件最大 Ic 为 20 mA,但同时受 Pd(75 mW)约束。例如在 5 V 供电且 Vce ≈ 5 V 情况下,理论上 Ic 不应超过 75 mW / 5 V = 15 mA,以免超过功耗限制。推荐在设计中留有裕度(常用 Ic 工作点通常在 µA~mA 级)。
  2. 负载电阻选取示例:若在 5 V 单电源下采用共集/共发配置,若允许最大集电流 10 mA,则串联负载 Rc ≈ (5 V - VCE_sat) / 10 mA ≈ 470 Ω(取 VCE_sat ≈ 0.2 V)。
  3. 抗饱和与响应速度:增大负载电阻可提高灵敏度但降低响应速度;若需要高速响应,建议减小负载阻值并采用集电极跟随或射极跟随电路以优化带宽。
  4. 环境与光源匹配:峰值在 860 nm,配合 850–940 nm 红外 LED 有较好响应。强环境光(太阳光、荧光灯)会引起基底光电流,必要时加光学滤光或机械遮光结构。
  5. 温度影响:高温会增加暗电流与灵敏度漂移,应用时需考虑温度补偿或校准。
  6. 焊接与机械:通孔插件易于安装,注意不要长时间将封装受超高温焊接(遵循厂商焊接温度与时间限制),避免机械应力损伤引脚与封装。

五、封装与环境要求

PT908-7C 为通孔(插件)封装,管长 4.5 mm,适合传统 PCB 插装与手工焊接工艺。工作温度 -25 ℃ 至 +85 ℃,在恶劣环境(高湿、高温、有腐蚀性气体)中应采取防护措施(涂覆、密封或选择适配外壳)。

六、选购与替代建议

PT908-7C(BIN4) 属于标准低电流红外光敏晶体管系列,若需更高电流或更高功率耗散,应考虑其他型号或改用光电二极管配合运放/比较器的方案。选型时关注峰值波长、暗电流、最大 Ic 与 Pd 三者的匹配,确保在目标应用的光照与电源条件下工作在安全区间。

总之,PT908-7C(BIN4) 以其低暗电流、良好 860 nm 响应和通孔封装,适合多种短距红外感测与开关场合。设计时应优先考虑功耗和热限制,合理选择负载与光学配合,以保证稳定可靠的系统性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.