Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EL827 是由台湾亿光(Everlight Electronics Co Ltd)生产的一款高性能光耦合器,采用 DIL-8(8-DIP)封装。该产品主要用于电气隔离、信号传输和电压转换,其主要特点包括高电流传输比、宽工作温度范围和优良的上升/下降时间,非常适用于工业自动化、消费电子和通信设备等领域。
电流传输比: EL827 在 5mA 输入电流下,最小电流传输比可达到 50%,最大可达 600%。这意味着即使在低输入电流条件下,输出电流也能满足高动态负载的要求,确保信号传输的可靠性。
最大输出电压与电流: 最大输出电压可达 80V,输出电流为 50mA,进一步提升了EL827在高电压、高电流场合下的应用潜力。
正向电压 (Vf): 前向电压典型值为 1.2V,Vce饱和压降最大为 200mV,表明在传输过程中,功耗较低,有助于提高系统的整体能效。
工作温度范围: -55°C 至 110°C,确保了产品在极端环境下的稳定性和可靠性,能够满足各种工业应用的严格需求。
EL827的上升时间和下降时间典型值分别为3µs和4µs,这意味着其在开关速度上表现优异,能够有效处理高速信号,适合用于需要快速响应的系统。
EL827 的通孔封装设计使得其易于在各种电路板上进行安装,适合不同的布线布局。由于其电气隔离特性和优良的工作参数,此款光耦广泛应用于:
电力控制系统: 在电机驱动、UPS电源及逆变器中,EL827有效隔离控制电流与高电压部分。
消费电子: 在家电及智能家居设备中使用,为元件间提供安全隔离和信号兼容。
通信设备: 在数据交换和信号处理模块中,用于实现信号的高效传输和绝缘保护。
与市场上其他同类产品相比,EL827 的优势不仅体现在其高电流传输比和广泛的工作温度范围上,还在于其卓越的上升/下降时间,确保了信号的快速切换。这使得EL827 成为高速信号处理和应用需求日益增长的当今市场中不可或缺的解决方案。
EL827 以其卓越的电气性能、可靠的工作环境适应性和易于安装的特点,为各种电力和信号处理应用提供了高效的解决方案。无论是在工业自动化、消费电子还是通信设备领域,其都展现出了良好的性能和广阔的应用潜力。基于其应对复杂电路环境的能力,EL827 显示出强劲的市场竞争力,是现代电子设计和工程中的优选器件。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products