WMSIC Electronic Components

EVERLIGHT EL3H7(A)(TA)-VG EL3H7

ModelEL3H7(A)(TA)-VG
PackageSOIC-4-175mil
BrandEVERLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
EVERLIGHT EL3H7(A)(TA)-VG
Type
EVERLIGHT
Unit
Electronic Component
Minimum package
6000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
EVERLIGHT
Electronic Component
EL3H7(A)(TA)-VG
Electronic Component
1
Package
SOIC-4-175mil
Electronic Component
Transistor Output Optocoupler
Electronic Component
1.316g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0220170921
Operating Temperature
55℃~+110℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:EL3H7(A)(TA)-VG

EL3H7(A)(TA)-VG是由台湾亿光(EVERLIGHT)出品的一款高性能光耦合器,采用先进的表面贴装技术(SMD)。该产品特别设计用于电气隔离和信号传输,广泛应用于各种电子设备和系统中。其内置的晶体管输出可实现高效、可靠的数据传输和控制,是现代电子设计中不可或缺的组件之一。

基本参数与特性

  1. 通道数与隔离电压: EL3H7(A)(TA)-VG具有单通道设计,能够提供高达3750Vrms的电气隔离电压。这一点对于确保系统的安全性和稳定性至关重要,特别是在高电压或高噪声环境中工作时。

  2. 电流传输比: 该设备的电流传输比(CTR)在5mA时的最小值为80%,最大值可达160%。这意味着光耦在输入和输出之间能够有效地转换信号,保证信号在传输过程中的完整性,适应不同的电流需求。

  3. 上升/下降时间: EL3H7(A)(TA)-VG的上升时间为5µs,下降时间为3µs,显示出其快速响应的能力。这一特性适合各种需要快速信号切换的应用场景,如开关电源、信号隔离和快速数据传输。

  4. 电压和电流输出: 本光耦的输出电压最大可达80V,输出电流最大为50mA,能够满足大多数工业和民用电子设备的要求。典型的正向压降(Vf)为1.2V,而最大正向电流(If)为50mA,这使其在运行时稳妥可靠。

  5. Vce饱和压降: EL3H7(A)(TA)-VG的Vce饱和压降仅为200mV,意味着在开关状态下,该器件在导通时的电压损失非常小,有助于提高系统能效和降低发热量。

  6. 环境适应性: 该产品的工作温度范围为-55°C到110°C,适应各种极端环境,为应用于高温、高压和复杂环境的电子设备提供可靠保障。

  7. 封装设计: EL3H7(A)(TA)-VG采用4-SOIC封装(宽度为4.40mm),其紧凑的设计方便各种电路板的布局,尤其是在空间受限的应用场合。表面贴装型的设计使得其易于实现自动化生产,提高制造效率。

应用领域

EL3H7(A)(TA)-VG光耦合器广泛应用于以下领域:

  • 电源管理系统:用于隔离输入和控制电路,保护后级设备和用户的安全。
  • 工业自动化:在PLC和传感器之间提供信号隔离和转换,确保信号的准确性和系统的稳定性。
  • 消费电子:在家电等控制系统中,提供电气隔离,增加系统的安全性和可靠性。
  • 通信设备:支持高速信号传输,除了实现电气隔离外还能减少噪声干扰。

总结

综上所述,EL3H7(A)(TA)-VG光耦合器凭借其卓越的性能、广泛的应用范围和高可靠性,成为现代电子设计中不可或缺的关键组件。其出色的电气特性和合理的封装设计,使其在市场中具有强大的竞争力,对于追求高效和安全的电子系统开发者而言,是一个极具吸引力的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.