WMSIC Electronic Components

ElecSuper SP3485EEN

ModelSP3485EEN
PackageSOP-8
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super SP3485EEN
Type
ELECSUPER
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
SP3485EEN
Electronic Component
1
Package
SOP-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.173g
Electronic Component
256
Electronic Component
1
Features
Tx / Rx;;; Low Power
Electronic Component
BM0258772056
Operating Temperature
40℃~+125℃
Operating Voltage
3V~5.5V
Receiver
1
Data
14Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP3485EEN 产品概述

一、产品简介

SP3485EEN 是由 ElecSuper(静芯微)出品的一款通用收发器,集成1路驱动器和1路接收器,工作于半双工差分通信模式。器件工作电压范围宽(3.0V~5.5V),适配多种3.3V与5V系统,封装为常见的 SOP-8,便于标准贴片生产与替换。

二、主要特性

  • 支持高达 14 Mbps 的数据速率,满足高速串行差分总线数据传输需求。
  • 最大节点支持 256 个,从而适用于大规模多点网络。
  • 极低静态电流:静态工作电流仅约 240 µA,有利于低功耗系统和待机节能设计。
  • 宽温工作范围:-40 ℃ 至 +125 ℃,适合工业级及恶劣环境应用。
  • 强抗静电能力:外部静电保护达 ±15 kV(接触/空气放电),提升系统可靠性。
  • 半双工通讯,收发在同一差分总线上切换,简化布线。

三、电气与环境参数(概要)

  • 工作电压:3.0 V ~ 5.5 V
  • 数据速率:最高 14 Mbps(取决于线路长度与终端匹配)
  • 节点数:最多可支撑至 256 节点(实际取决于总线拓扑与驱动能力)
  • 静态电流:约 240 µA
  • 温度范围:-40 ℃ ~ +125 ℃
  • ESD:±15 kV(人体模型/空气放电)

四、典型应用场景

  • 工业控制总线、多点数据采集系统
  • 楼宇自控、安防与门禁通信网络
  • 仪器仪表与变送器的远程通信
  • 能源计量、现场总线与串行多点连网场合

五、使用与PCB布局建议

  • 在 VCC 侧尽量将 0.1 µF 陶瓷旁路电容靠近器件电源脚放置,以抑制瞬态噪声。
  • 差分对走线应成对并行且长度匹配,避开大面积噪声源,保持阻抗连续。
  • 总线两端应采用合适的终端电阻并考虑偏置网络(上拉/下拉电阻)以实现失效保护与总线静态确定性。
  • 尽量避免总线上存在长分支(stub),以减少反射与信号失真。
  • 在强干扰环境下,可在差分线旁加小电容或共模扼流圈进行滤波,但需注意对速率的影响。
  • 注意印制板接地设计与数字/模拟分区,降低共模噪声耦合风险。

六、注意事项

  • 虽然器件支持高节点数,但实际节点容量受总线终端匹配、线长与负载特性影响,设计时应综合评估。
  • 半双工模式需在协议或硬件上做好主从与驱动使能的切换控制,避免总线冲突。
  • 在选型与替换时,注意封装引脚和热设计匹配,确保长期可靠性。

SP3485EEN 以其宽电压范围、低静态功耗和工业级温度/ESD 规格,适合对可靠性与抗干扰要求较高的差分半双工通信应用。

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