WMSIC Electronic Components

ElecSuper BZT52C15

ModelBZT52C15
PackageSOD-123
BrandElec Super
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Elec Super BZT52C15
Type
ELECSUPER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ELECSUPER
Electronic Component
BZT52C15
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.034g
Electronic Component
1
(Zzk)
200Ω
(Zzt)
30Ω
Electronic Component
BM0265825482
Diode
1
Current(Ir)
1uA
Power Dissipation(Pd)
500mW
Electronic Component
13.8V~15.6V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C15稳压二极管产品概述

BZT52C15是静芯微(ElecSuper)推出的一款独立式稳压二极管,专为小功率电子设备的电压稳定、基准参考及过压保护场景优化设计。其核心参数与封装特性适配现代紧凑型电路需求,以下从多维度展开详细概述。

一、核心基础参数解析

BZT52C15的关键参数明确覆盖了稳压二极管的核心性能指标,具体如下:

  • 二极管配置:独立式设计,无内置辅助元件,可灵活适配不同电路拓扑;
  • 稳压值:标称值15V,工作范围13.8V~15.6V(覆盖±8%公差),满足多数通用电路的稳压需求;
  • 反向漏电流(Ir):1μA(典型值),反向偏置时漏电流极小,有效降低待机功耗;
  • 耗散功率(Pd):最大500mW,适配小功率应用场景;
  • 动态阻抗:稳压工作点动态阻抗Zzt=30Ω(测试电流下),反向击穿前阻抗Zzk=200Ω,保证稳压精度;
  • 封装形式:SOD-123表面贴装封装,尺寸紧凑(约1.6mm×0.8mm),适合高密度PCB布局。

二、产品关键特性

  1. 低反向漏电流设计:1μA的反向漏电流显著降低器件待机功耗,尤其适合电池供电的便携式设备(如智能穿戴、蓝牙模块),延长续航时间;
  2. 稳定的稳压性能:标称15V稳压值的工作范围覆盖13.8V~15.6V,参数一致性良好,可满足不同电路对稳压精度的微调需求;
  3. 小体积贴片封装:SOD-123封装体积小、重量轻,适配自动化贴片生产,同时节省PCB空间,支持紧凑型电子设备设计;
  4. 小功率适配性:500mW的最大耗散功率虽不支持大功率负载,但可覆盖多数小型电子设备的稳压、保护需求(如MCU电源、传感器节点)。

三、典型应用场景

BZT52C15的参数特性使其在多个领域具有实用价值:

  1. 电源电路稳压:作为后级电路的稳压元件,将电压钳位在15V左右,保护MCU、运放等敏感器件免受过压冲击;
  2. 基准电压源:为模拟电路(如ADC、比较器)提供15V稳定基准,保证信号采集与处理的精度;
  3. 过压保护元件:当电路输入电压超过15V时,器件反向击穿导通,将电压钳位在稳压值范围内,避免后级器件损坏;
  4. 小型电子设备稳压:适配蓝牙模块、物联网终端、小型传感器等低功耗设备的电源稳压需求,兼顾体积与性能。

四、品牌与封装优势

  • 静芯微(ElecSuper)品牌保障:作为国内专注于分立器件的品牌,产品经过温度循环、湿度老化等可靠性测试,参数一致性与稳定性符合工业级标准;
  • SOD-123封装优势:表面贴装设计支持高速自动化生产,引脚间距合理(约0.8mm),焊接工艺成熟,同时体积紧凑,适配高密度PCB布局。

五、应用注意事项

  1. 耗散功率限制:使用时需计算通过器件的电流,确保Pd=V_z×I ≤500mW(V_z为稳压值,I为工作电流),避免功率过载损坏;
  2. 工作电流匹配:稳压工作时需使电流处于合理范围(通常接近测试电流),以保证Zzt=30Ω的低动态阻抗特性;
  3. 反向偏置注意:Ir=1μA为反向偏置(电压低于稳压值)时的漏电流,稳压工作需工作在反向击穿区,不可长期处于反向偏置过压状态;
  4. 焊接工艺要求:SOD-123封装焊接温度需控制在260℃以下(焊接时间≤3秒),避免高温损坏器件。

总结

BZT52C15稳压二极管凭借低漏电流、小体积、适配小功率场景的特性,在便携式电子、物联网终端、小型电源电路等领域具有广泛应用价值。静芯微的可靠性保障使其成为电子设计中稳压与保护的可靠选择,可满足多数通用小功率电路的核心需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.