Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ElecSuper IRFR1205TRPBF-ES IRFR1205TRPBF
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Elec Super IRFR1205TRPBF-ES
- Type
- ELECSUPER
- Minimum package
- 2500 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ELECSUPER
- Electronic Component
- IRFR1205TRPBF-ES
- Electronic Component
- 1
- Package
- TO-252
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.463g
- Electronic Component
- 1
- Electronic Component
- BM0234660052
- Power Dissipation(Pd)
- 25W
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
- Voltage(Vdss)
- 60V
- Capacitor(Ciss)
- 860pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
IRFR1205TRPBF-ES 产品概述
一、产品简介
IRFR1205TRPBF-ES 是 ElecSuper（静芯微）推出的一款 N 沟道功率 MOSFET，适用于中低压、高电流的开关和线性负载场合。器件在 TO-252 封装中提供良好的导热路径与面积利用率，单片规格可满足常见的电源管理和电机驱动需求。
二、主要规格
- 类型：N 沟道 MOSFET
- 漏源耐压 Vdss：60 V
- 连续漏极电流 Id：20 A
- 导通电阻 RDS(on)：26 mΩ @ Vgs=10 V；33 mΩ @ Vgs=4.5 V
- 最大耗散功率 Pd：25 W（封装及散热条件相关）
- 阈值电压 Vgs(th)：1.6 V @ Id=250 µA
- 总栅极电荷 Qg：20.3 nC @ Vgs=10 V
- 输入电容 Ciss：860 pF；反向传输电容 Crss：51 pF；输出电容 Coss：62 pF
- 封装：TO-252
三、关键特性与优势
- 低导通电阻在满栅压（10 V）下可显著降低导通损耗，适合高效率设计。
- 中等栅极电荷（20.3 nC）在开关速度与驱动功率之间取得平衡，既可实现较快切换又不会对驱动器造成过重负担。
- 60 V 电压等级适合汽车附件、工业电源与中间母线应用。
- TO-252 封装便于 PCB 安装和散热设计，适合批量生产与自动贴装。
四、典型应用场景
- 同步整流和降压转换器（DC-DC）
- 马达驱动开关单元与负载开关
- 开关电源与功率管理模块
- 通信设备与工业控制的功率开关
五、封装与热管理建议
- 封装为 TO-252，建议在 PCB 采用对应散热铜箔和焊盘，必要时结合过孔导入底层散热层。
- 在实际电流条件下按 P = I^2·RDS(on) 估算导通损耗，并结合开关损耗（与 Qg、开关频率相关）计算总热量，确认散热裕量。
- 对于高频开关场合，适当增加栅极电阻以抑制振铃并配合 RC/TVS 抑制尖峰。
六、选型注意事项
- 若系统能提供 10 V 栅极驱动，可获得最低 RDS(on)；若只能驱动到 4.5 V，应按 33 mΩ 的 RDS(on) 重新评估损耗。
- 高频应用需权衡 Qg 带来的驱动能耗与开关损耗。
- 对感性负载务必做好过压保护与回路布局，避免 Crss 引入的 Miller 效应导致误开关。
七、总结
IRFR1205TRPBF-ES 在 60 V/20 A 等级下以较低的导通电阻和适中的栅极电荷，提供了良好的能效与可驱动性，适合多数中低压电源与功率开关场景。根据实际工作电压、开关频率和散热条件进行合理的驱动与 PCB 设计，可发挥其最佳性能。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
