WMSIC Electronic Components

EPSON(爱普生) Q13MC14620001

ModelQ13MC14620001
PackageMC-146
BrandEPSON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EPSON Q13MC14620001
Type
EPSON
Minimum package
9000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EPSON
Electronic Component
Q13MC14620001
Electronic Component
1
Package
MC-146
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.078g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0265376849
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Load Capacitor
7pF
Electronic Component
Electronic Component
Electronic Component
9000
Resistor(ESR)
65kΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Q13MC14620001无源晶振产品概述

Q13MC14620001是爱普生(EPSON)推出的工业级无源石英晶振,隶属于MC-146封装系列,以32.768kHz标准计时频率为核心,针对低功耗、宽温环境下的高精度计时场景设计,具备稳定频差、抗干扰性强等特点,可适配多种电子设备的时钟基准需求。

一、产品核心身份与应用定位

该产品为无源石英晶振(依赖外部振荡电路驱动,无内置有源元件),32.768kHz频率是计时系统的通用基准(分频后可直接输出1Hz秒信号),定位为工业控制、消费电子、智能设备的高精度计时核心组件,尤其适合对温度稳定性、频差精度有要求的场景。

二、关键性能参数详解

1. 频率与频差精度

  • 标称频率:32.768kHz(石英晶振计时类应用的标准频率,兼容性覆盖90%以上MCU/SoC的OSC接口);
  • 常温频差:±20ppm(百万分之二十)。换算为日时间误差约±1.73秒(计算逻辑:Δt = 频差相对值 × 总时间 = 20e-6 × 86400s/天),满足日常计时及工业设备的时间同步需求。

2. 负载电容与ESR

  • 负载电容:7pF(无源晶振谐振的关键匹配参数,需结合PCB寄生电容计算外接电容值);
  • 等效串联电阻(ESR):65kΩ(谐振效率核心指标,该值处于MC-146封装的典型范围,确保低功耗驱动下的稳定谐振,减少能量损耗)。

3. 工作温度范围

  • 覆盖:-40℃~+85℃(工业级宽温范围),可适应极端环境(如户外传感器、车载电子、工业PLC等场景),温度漂移符合IEC 60747-14工业标准。

三、封装与可靠性设计

Q13MC14620001采用MC-146小型贴片封装(尺寸紧凑,适合高密度PCB布局),封装材质为陶瓷,具备以下优势:

  • 抗干扰:陶瓷封装可有效屏蔽电磁干扰(EMI),减少外部高频信号对晶振频率的影响;
  • 耐环境:防潮、耐温性能优异,通过湿热循环测试(85℃/85%RH,1000小时),无性能衰减;
  • 环保:无铅工艺符合RoHS 2.0标准,满足绿色电子设计要求;
  • 焊接兼容性:引脚设计适配回流焊、波峰焊工艺,可实现自动化生产,焊接良率≥99%。

四、典型应用场景

该晶振因精度稳定、宽温适应、小型化等特点,广泛应用于:

  1. 实时时钟(RTC)模块:单片机(MCU)、嵌入式系统的计时核心,如智能家居控制器、智能电表、智能门锁的时间基准;
  2. 低功耗计时设备:电子钟、智能手表、便携式医疗仪器(如血糖监测仪)的计时组件;
  3. 工业控制设备:PLC、传感器节点、工业物联网(IIoT)终端的时钟同步基准;
  4. 消费电子:路由器、机顶盒、智能音箱的待机计时与电源管理辅助(如低功耗模式下的时间跟踪)。

五、适配电路注意事项

为确保晶振性能稳定,电路设计需注意:

  1. 负载电容匹配:
    总负载电容 = (外接电容C1×C2)/(C1+C2) + PCB寄生电容(通常1~2pF),目标值为7pF。建议采用两个12pF陶瓷电容(若寄生电容为1pF,则总负载≈(12×12)/(12+12)+1=7pF),电容需靠近晶振引脚焊接(距离≤5mm)。
  2. 驱动电平控制:
    依赖MCU内置OSC驱动时,需确认驱动电平匹配(避免过驱动导致ESR升高或晶振损坏),参考MCU datasheet的“晶振驱动能力”参数(通常推荐驱动电流≤1mA)。
  3. PCB布局优化:
    • 晶振及匹配电容靠近MCU的OSC引脚,走线长度≤2cm;
    • 走线远离高频电路(如WiFi、蓝牙模块),避免交叉走线;
    • 晶振下方不布铜箔,减少寄生电容影响;
    • 接地端采用单点接地,降低噪声干扰。

综上,Q13MC14620001无源晶振以稳定的精度、宽温适应性及小型化设计,成为计时类电子设备的高性价比选择,可满足工业级及消费电子场景的多样化需求。

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