Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Q13FC1350000300
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
14
specifications
Core information
- Product name
- EPSON Q13FC1350000300
- Type
- EPSON
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- EPSON
- Electronic Component
- Q13FC1350000300
- Electronic Component
- 1
- Package
- SMD3215-2P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.046g
- Electronic Component
- 1
- Electronic Component
- BM0084409831
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：Q13FC1350000300
基本信息
产品名称：Q13FC1350000300
描述：Crystal 0.032768MHz ±20ppm (Tol) 9pF FUND 70000Ohm 2-Pin CSMD T/R
品牌：EPSON (爱普生)
封装：SMD3215-2P
1. 介绍
Q13FC1350000300是由著名电子元器件制造商EPSON（爱普生）生产的一款高精度晶振（Crystal Oscillator），工作频率为32.768kHz，广泛应用于各种电子设备的时钟信号生成。凭借±20ppm的频率容差和9pF的负载电容，这款晶体振荡器在多种应用场景下表现出色，具备了优异的稳定性和可靠性。
2. 产品特性
- 频率：本产品的工作频率为0.032768MHz（32.768kHz），这一频率常用于实时时钟（RTC）及低功耗设备中，是取自于2的15次方的标准频率，方便进行时间的维护与计算。
- 频率容差：±20ppm的容差范围使得该晶体振荡器能在不同温度和电压的情况下保持较高的频率稳定性，适应多变的应用环境。
- 负载电容：9pF的负载电容设定，适用于多种电路设计，能够满足相关设备对于信号传递和频率稳定性的要求。
- 等效串联电阻：70000Ω的高等效串联电阻（ESR）确保了在低功耗工作条件下的稳定性，能够有效减小功耗，延长设备的使用寿命。
3. 封装与应用
Q13FC1350000300采用SMD3215-2P表面安装封装（CSMD），便于自动贴装过程，提高生产效率，减少手动操作所带来的误差。此种封装小巧、便于布线，也适合空间有限的电子设计，能够在占据更小面积的同时保证良好的电性能。
4. 应用领域
Q13FC1350000300晶振在多个领域都有广泛应用：
- 消费电子：用于手机、手表等产品中的时钟管理。
- 工业控制：在PLC（可编程逻辑控制器）和其他工业自动化设备中，作为时间基准。
- 汽车电子：用于汽车中的时序电路，保障各系统之间的协调运作。
- 医疗设备：在需要精确时间跟踪的各种医疗设备中提供时钟信号。
5. 设计考虑
在设计时，使用Q13FC1350000300可以显著提高系统的时间精度和稳定性。在PCB布线设计中，需要合理选择与晶体振荡器相连的负载电容值，确保其工作的最佳状态。同时，注意晶振周围的电路环境，避免长期、高强度的电磁干扰，以维护信号的清晰度和稳定性。
6. 结论
作为一款高性能的晶体振荡器，EPSON Q13FC1350000300凭借其优异的技术规格和良好的适应性，成为现代电子设备中的理想选择。无论是在消费电子、工业控制还是医疗设备的应用中，都能展现出其高稳定性和可靠性，满足不同领域对时钟信号产生的严格要求。选择Q13FC1350000300，将为您的产品带来优越的性能和可靠的时间管理能力。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
