WMSIC Electronic Components

EPSON(爱普生) X1E000021064800

ModelX1E000021064800
PackageSMD3225-4P
BrandEPSON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EPSON X1E000021064800
Type
EPSON
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EPSON
Electronic Component
X1E000021064800
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
1g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0259384913
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
18pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X1E000021064800 产品概述

一、概述

X1E000021064800 为爱普生(EPSON)系列贴片晶体谐振器(晶振),工作频率为 25.000 MHz,属于基频(FUND)4 引脚 Mini‑CSMD 封装(T/R 卷带包装),适用于对频率精度和温度稳定性有较高要求的数模混合、通信与时钟系统。器件在工业级温度范围内工作,适合嵌入式主控、网络设备、无线模块等应用。

二、主要技术参数

  • 标称频率:25.000 MHz
  • 常温频差(初始容差):±10 ppm
  • 频率稳定度(温度与老化等综合):±20 ppm
  • 负载电容(CL):18 pF
  • 等效串联电阻(ESR):40 Ω(典型/最大)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 振荡模式:Fundamental(基频)
  • 封装/引脚:4‑Pin Mini‑CSMD,卷带供料(T/R)

三、产品特点

  • 高频率精度高:±10 ppm 初始容差,可满足对时钟精度敏感的系统要求。
  • 良好温稳与长期稳定性:±20 ppm 的稳定度在工业温度范围内表现可靠。
  • 小型贴片封装和卷带包装,利于自动贴装与量产。
  • 适合基频振荡器设计,ESR 与负载电容配合易于达到启动与稳定工作条件。

四、典型应用

  • 单片机/微控制器时钟源(MCU、DSP)
  • 通信设备时钟与参考(以太网 PHY、USB、MCU 外围)
  • 无线模块与射频前端本振参考(需根据相位噪声要求评估)
  • 工业控制、测试测量设备时钟参考

五、使用与焊接建议

  • 负载电容匹配:若采用对称电容,理论每侧电容约为 C1=C2≈2·CL−Cstray,常见实用值在 27–33 pF 范围,需根据 PCB 板上寄生电容调整。
  • 布局:晶振接近振荡器输入脚,避开高速信号线与噪声源,接地应做短回流路径。
  • 焊接:遵循厂家推荐回流曲线,避免过高温度/时间或重复回流。卷带包装适配自动贴装,焊膏用量与焊盘尺寸按数据手册建议。
  • ESD 防护:运输和贴装过程注意静电防护,晶振对静电敏感。

六、可靠性与存储

  • 推荐长期储存于干燥、防潮环境,避免高温与强震动。
  • 在关键设计中建议进行上板后老化测试与温度循环验证,以确保频率稳定性满足系统要求。

七、选型与采购建议

  • 在最终选型前,请索取并核对厂方数据手册以确认封装图、焊盘尺寸、回流曲线及全部电气特性。
  • 若对相位噪声、启动时间或更严格温漂有更高要求,可与厂家沟通或选择相邻等级产品。
  • 卷带(T/R)包装方便批量生产,下单时注意最小起订量与交货周期。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.