Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EPSON(爱普生)作为全球石英晶振领域的老牌厂商,在高精度计时元件研发上有超过50年的技术积淀,其有源晶振产品覆盖从消费电子到工业级的全场景需求。X1G0041710033是一款针对通用计时场景优化的25MHz CMOS有源晶振,主打「小尺寸、宽电压、工业级温度适应」三大核心卖点,适合对精度、可靠性有基础要求的电子设计,是替代无源晶振的高性价比选择。
主频率固定为25MHz,常温下频差±50ppm(换算为Hz即±1250Hz)——这一精度远高于无源晶振(通常±20ppm以上且需额外匹配电容),能满足大多数MCU、通信接口的时钟稳定需求,避免数据传输丢包或MCU运行异常。
采用CMOS输出模式,输出电平与3.3V、1.8V等主流MCU的IO口完全兼容,无需额外添加电平转换芯片,直接焊接即可使用,大幅简化电路设计。
支持1.62V~3.63V宽电压范围,覆盖了1.8V低功耗系统(如智能穿戴)和3.3V工业级模块的供电需求;工作电流仅2.2mA,在有源晶振中属于中等功耗水平,兼顾性能与电池续航(若用于便携设备)。
SMD2520-4P封装,尺寸为2.5mm×2.0mm×0.7mm,4引脚贴片结构——比传统5032封装节省约60%的空间,适合高密度PCB设计(如智能手表、小型传感器节点)。
X1G0041710033的工作温度范围为**-40℃~+85℃**,属于工业级温度标准,能适应户外、车载、车间等极端温度场景;同时爱普生对该产品进行了严格的72小时以上老化测试,确保长期使用中频率漂移在允许范围内,抗电磁干扰能力也优于无源晶振(内置振荡电路减少外部干扰影响)。
替代STM32、PIC、ATmega等MCU的无源晶振,无需匹配电容,降低BOM成本和调试难度,适合家电控制、智能硬件等产品。
作为UART、SPI、I2C等串行接口的时钟,确保数据传输速率稳定(如25MHz分频后可得到1.25MHz的SPI时钟),应用于传感器组网、蓝牙模块辅助计时。
PLC、电机控制器、工业传感器节点的主时钟,宽温范围适应车间高温或低温环境,可靠运行无故障。
智能穿戴(如智能手环的心率传感器时钟)、智能家居(如WiFi模块辅助时钟),小尺寸封装适配设备轻薄化需求。
综上,X1G0041710033是一款性能均衡、适配性强的通用有源晶振,能满足大多数中低端到中端电子设备的计时需求,是工程师选型的可靠选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products