WMSIC Electronic Components

Q13MC30620006

ModelQ13MC30620006
PackageMC-306
BrandEPSON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EPSON Q13MC30620006
Type
EPSON
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EPSON
Electronic Component
Q13MC30620006
Electronic Component
1
Package
MC-306
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.246g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0257588018
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
6pF
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Q13MC30620006 产品概述

一、产品简介

Q13MC30620006 为爱普生(EPSON)生产的无源贴片石英晶体,基频 32.768 kHz,封装为 MC-306,专为低功耗实时时钟(RTC)与计时应用设计。该器件为无源晶振,需与外部振荡器电路(常用皮尔斯振荡器)搭配使用,体积小、稳定性高,适合消费类与工业级电子产品的时间基准需求。

二、主要参数

  • 晶振类型:贴片(无源晶振)
  • 频率:32.768 kHz
  • 常温频差:±20 ppm
  • 负载电容(CL):6 pF
  • 等效串联电阻(ESR):35 kΩ
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 品牌:EPSON(爱普生)
  • 封装:MC-306

三、典型应用

  • 微控制器与片上RTC的时间基准
  • 手表、时钟与计时器
  • 能源计量装置与智能表计
  • 低功耗传感器节点与物联网终端
  • 工业控制与数据记录系统的实时时钟模块

四、设计与使用注意事项

  1. 负载电容匹配:晶体标称 CL 为 6 pF。PCB 与输入电路存在寄生电容(Cstray,典型约 2–3 pF),计算公式为: CL = (C1 × C2) / (C1 + C2) + Cstray 若采用对称电容 C1 = C2,则可按示例选择:若 Cstray ≈ 2 pF,则 C1 ≈ C2 ≈ 8 pF 可满足 CL=6 pF。
  2. ESR 与启动性:本型号 ESR 约 35 kΩ,属于低频晶体的常见范围。较高的 ESR 会延长启动时间并要求晶体振荡电路具有足够的增益和适当偏置。建议采用标准皮尔斯振荡器拓扑并参考 MCU 或振荡器芯片的驱动能力说明。
  3. 外围电阻与振幅控制:在反相器输入输出之间需要并联高阻值偏置电阻(兆欧级)以将放大器点定位于线性区域;根据具体驱动芯片,必要时在晶体串联限流或限幅电阻以保护晶体并控制振荡幅度。
  4. 布局与接地:晶体尽量靠近 MCU 振荡器引脚布置,负载电容布局对称、走线短且靠近晶体与 MCU 引脚,避免走线跨过敏感模拟或高频信号,良好接地可降低噪声影响。

五、封装与可靠性

MC-306 封装为贴片型,适合回流焊装配。晶体对机械应力敏感,贴片过程中应避免过度弯曲与机械冲击。存储与焊接应参考制造商资料,遵循湿敏等级与回流曲线要求以确保可靠性。

六、采购与技术支持

型号:Q13MC30620006,品牌 EPSON(爱普生)。采购时请确认所需频差、温度范围与封装版本,并参考原厂数据表以获取完整电气、机电与焊接规范。若用于关键计时或工业环境,建议与供应商沟通样片测试与长期稳定性验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.