Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X1G0041710047是爱普生(EPSON)推出的一款CMOS输出有源晶振,采用SMD2520-4P表面贴装封装。该产品针对现代电子设备的轻薄化、低功耗需求设计,核心定位为中小尺寸设备的稳定时钟参考源,兼具工业级环境适应性。
标称频率为50MHz,常温(25℃)下的频率偏差为**±50ppm**(换算为频率波动范围±2.5kHz),满足多数数字电路(如MCU、通信芯片)对时钟精度的基本要求,无需额外校准即可稳定驱动核心器件。
采用SMD2520-4P封装,尺寸为2.5mm×2.0mm×0.7mm(长×宽×高),4引脚布局紧凑,可有效节省PCB空间,适配小型化电子设备的高密度布线需求。
该产品支持**-40℃+85℃的工业级工作温度范围,可在低温环境(如北方户外设备)、高温环境(如工业控制柜内)稳定运行,无需额外散热/保温措施;存储温度范围通常为-55℃+125℃**(爱普生晶振常规参数),具备良好的环境耐受性。
结合参数特性,X1G0041710047可广泛应用于以下领域:
总结:X1G0041710047是一款性能均衡、适配性强的有源晶振,凭借稳定的频率精度、宽电压/宽温适应性、低功耗及小型化封装,可满足多领域电子设备的时钟参考需求,是系统设计中可靠的时钟源选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products