WMSIC Electronic Components

X1A0000610002

ModelX1A0000610002
PackageSMD2012-2P
BrandEPSON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EPSON X1A0000610002
Type
EPSON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EPSON
Electronic Component
X1A0000610002
Electronic Component
1
Package
SMD2012-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.035g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0264601951
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12.5pF
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EPSON无源晶振X1A0000610002产品概述

一、基本信息梳理

X1A0000610002是爱普生(EPSON)推出的无源贴片时钟晶振,专为低功耗实时时钟(RTC)及定时同步场景优化。该产品采用SMD2012-2P封装(尺寸约2.0×1.2mm),属于2引脚贴片式无源晶振(无需外部电源驱动,依赖振荡电路提供能量),核心频率为32.768kHz——电子设备中实现精准时间基准的标准频率之一,广泛适配消费电子、工业控制及物联网终端。

二、核心性能参数详解

1. 频率与精度

  • 基准频率:32.768kHz,因“1秒=32768个周期”的特性,天然适配RTC模块的分频需求(仅需15级二分频即可得到1Hz秒信号),无需复杂分频电路;
  • 常温频差:±20ppm,即频率偏差范围为±0.655Hz,可满足普通手表、智能手环等设备的时间精度需求(日均误差约5.6秒,符合日常使用标准)。

2. 关键电气参数

  • 负载电容:12.5pF(晶振正常振荡的匹配电容,电路设计需考虑PCB寄生电容,实际并联电容需调整为12.5pF左右);
  • 等效串联电阻(ESR):≤90kΩ(振荡损耗核心参数,越低则驱动功率越小、稳定性越高,该值适配多数CMOS振荡电路);
  • 工作温度:-40℃~+85℃(宽温范围覆盖工业环境、户外终端及车载场景,避免温度漂移导致频率偏差过大)。

三、典型应用场景

X1A0000610002的性能适配多领域低功耗定时需求:

  1. 实时时钟(RTC)模块:智能手表、手环、智能家居网关的时间基准,提供稳定秒级信号;
  2. 消费电子终端:手机、平板、笔记本的待机时钟,维持休眠时时间同步,避免重启重置;
  3. 工业控制设备:PLC、工业传感器节点的定时采样与设备间同步;
  4. 物联网低功耗终端:智能水表、电表、燃气表的时间戳功能(支持远程抄表);
  5. 车载电子:车载信息娱乐系统、行车记录仪的时间基准(适应车载温度变化)。

四、产品核心优势

  1. 品牌可靠性:EPSON作为全球晶振龙头,产品经严格可靠性测试(如振动、老化),长期运行故障率低;
  2. 小封装适配:SMD2012-2P封装体积小巧,适合可穿戴设备、微型传感器的高密度PCB布局;
  3. 成本性能平衡:±20ppm精度满足多数场景,避免高精度晶振的高成本,适合量产;
  4. 宽温稳定性:无需额外温度补偿电路,即可在-40℃~+85℃范围内稳定振荡;
  5. 低功耗适配:无源晶振无外部电源需求,配合CMOS振荡电路可实现μW级功耗,适配电池供电设备。

五、封装与安装注意事项

  1. 封装尺寸:2.0mm(长)×1.2mm(宽)×0.5mm(厚),引脚间距0.8mm,需匹配PCB焊盘设计;
  2. 焊接要求:采用回流焊工艺,峰值温度≤260℃(回流时间≤10秒),避免高温损坏晶振;
  3. 电路匹配:晶振两端并联总负载电容12.5pF(通常用两个6.2pF电容,需扣除PCB寄生电容);
  4. 静电防护:无源晶振对静电敏感,安装需佩戴静电手环、使用防静电工作台,避免静电击穿内部结构。

该产品凭借稳定的性能、小巧的封装及宽温适配性,成为各类低功耗定时场景的主流选择。

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