WMSIC Electronic Components

X1E000021012700

ModelX1E000021012700
PackageSMD3225-4P
BrandEPSON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EPSON X1E000021012700
Type
EPSON
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EPSON
Electronic Component
X1E000021012700
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.053g
Frequency
24MHz
Electronic Component
1
Electronic Component
BM0228746553
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
9pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X1E000021012700 产品概述

X1E000021012700 是 EPSON(爱普生)出品的一款 SMD 贴片晶振,隶属于 MHz Range Crystal 系列,封装为 SMD3225-4P。该器件以 24.000 MHz 标称频率工作,面向微控制器时钟、嵌入式系统及各类需要高精度参考频率的电子设备。

一、主要规格概述

  • 晶振类型:贴片晶振(SMD)
  • 品牌:EPSON(爱普生)
  • 封装:SMD3225-4P(尺寸约 3.2 × 2.5 mm)
  • 标称频率:24 MHz
  • 常温频差:±10 ppm(室温基准偏差)
  • 频率稳定度(温度范围内):±20 ppm
  • 等效串联电阻(ESR):40 Ω
  • 负载电容:9 pF
  • 工作温度范围:-40 ℃ ~ +85 ℃

二、性能亮点与适用场景

X1E000021012700 在中等温度范围内提供良好的频率稳定性与较小的常温偏差,适合要求相对高精度的系统时钟使用。典型应用包括:

  • MCU/微控制器时钟源
  • 通信模块参考时钟
  • 消费类电子、仪表与工业控制设备
  • 音视频同步与数据采集系统

注意:ESR 为 40 Ω,某些对启动摆幅要求较高的 MCU 内部振荡器可能需要验证能否可靠起振;在不确定时建议做上电试验或参照 MCU 厂家推荐晶体参数。

三、设计与布局建议

  • 晶体应尽量靠近 MCU 或振荡器输入引脚放置,走线短且对称,避免与高速信号并行走线。
  • 两侧负载电容取值需满足等效负载电容 CL = (C1 × C2) / (C1 + C2) + Cstray。对标称 CL = 9 pF,典型做法是选择每侧约 18 pF 的电容(需考虑 PCB 寄生电容),并通过实验微调以达到最佳频率与稳定性。
  • 地平面应良好且尽量完整,晶振周围避免大面积切割或穿越高速信号;必要时将地连接为单点或短回路。
  • 避免在晶振附近放置大电流回路或干扰源(DC-DC、晶体管阵列等),以降低相位噪声与频率抖动。

四、可靠性与环境适配

器件工作温度 -40 ℃ ~ +85 ℃,适合常见工业级与消费级环境。频率稳定度在全温区内保持 ±20 ppm,满足多数对温漂要求较高的场合。长期老化特性、抗冲击与抗振动能力及回流焊工艺可靠性请参考 EPSON 官方数据手册与推荐的焊接曲线。

五、选型与验证要点

  • 验证 MCU 或振荡电路的驱动能力是否能在 40 Ω ESR 下可靠起振;
  • 实际系统中测量上电启动时间、稳频时间与相位噪声是否满足需求;
  • 如果系统对频率精度要求更严(例如低 ppm 或长期漂移),可考虑温补晶振(TCXO)或更高等级器件;
  • 在更换或替代型号时,注意封装匹配(SMD3225-4P)及负载电容、ESR 等关键参数的一致性。

六、使用与存储注意事项

  • 采用推荐的回流焊工艺作业,避免超出制造商规定的温度/时间曲线;
  • 芯片应按 EPSON 的包装与干燥储存规范保存,避免长期潮湿影响可焊性;
  • 在最终产品调试阶段,建议做环境温度循环测试与长期老化测试,确认频率漂移与可靠性满足设计要求。

结语:X1E000021012700 以其 24 MHz 的稳定频率、紧凑的 SMD3225 封装及工业温度等级,适合多类对时钟精度与可靠性有要求的嵌入式应用。具体电路集成、负载电容选型与焊接参数应结合 EPSON 官方资料与样片测试结果进行最终确认。

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