WMSIC Electronic Components

X1G0042110003

ModelX1G0042110003
PackageSMD2520-6P
BrandEPSON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EPSON X1G0042110003
Type
EPSON
Minimum package
2000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EPSON
Electronic Component
X1G0042110003
Electronic Component
1
Package
SMD2520-6P
Electronic Component
Temperature-Compensated Crystal Oscillator (TCXO)
Electronic Component
0.059g
Frequency
26MHz
Electronic Component
1
Electronic Component
BM0265376899
Operating Temperature
30℃~+85℃
Operating Voltage
2.85V~3.15V
Operating Current
1.5mA
Output
Electronic Component
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EPSON X1G0042110003温度补偿晶体振荡器(TCXO)产品概述

一、产品定位与核心属性

EPSON X1G0042110003是一款温度补偿晶体振荡器(TCXO),属于高精度时钟源器件。区别于普通晶体振荡器(XO),其内置温度补偿电路,可有效抑制温度变化对输出频率的漂移影响,确保宽温范围内的频率稳定性。该产品以26MHz为固定输出频率,采用削峰正弦波输出模式,搭配小型化SMD2520-6P封装,适配多类对时钟精度、功耗及空间有要求的电子设备。

二、关键电气参数与实际价值

  1. 频率特性:固定输出频率26MHz,是通信、消费电子领域的常见基准时钟(如蓝牙、WiFi模块主时钟),满足多数中高端设备的同步需求;
  2. 输出模式:削峰正弦波——既保留正弦波的低谐波干扰特性,又通过削峰提升信号驱动能力,平衡波形纯度与负载兼容性,避免方波输出的高频噪声问题;
  3. 电源适配:工作电压范围2.85V~3.15V,覆盖主流3V供电系统(如MCU、低功耗通信芯片),无需额外电压转换,简化系统设计;
  4. 功耗表现:典型工作电流1.5mA,属于TCXO品类中的低功耗水平,适配电池供电设备(如穿戴设备、便携通信模块),延长续航;
  5. 温度范围:工作温度-30℃~+85℃,达到工业级标准,可适应户外低温(北方冬季设备)、高温(车载仪表、工业节点)等复杂环境,避免频率漂移。

三、封装与物理特性

该产品采用SMD2520-6P表面贴装封装:

  • 尺寸规格:2.5mm(长)×2.0mm(宽),属于小型化贴片封装,节省PCB空间,适配高密度设计(如智能手表、小型传感器节点);
  • 引脚数量:6引脚,支持标准贴片焊接工艺,兼容性好,便于自动化生产;
  • 封装材质:采用耐高温、抗冲击的陶瓷/塑料封装,确保焊接及使用中的可靠性。

四、典型应用场景

结合参数特性,X1G0042110003适用于以下场景:

  1. 低功耗通信模块:蓝牙5.x、LoRa、WiFi 6低功耗模块等,需稳定时钟保障数据传输精度,低功耗适配电池供电;
  2. 穿戴电子设备:智能手表、运动手环、健康监测设备,小尺寸+宽温满足便携与户外使用;
  3. 工业控制与传感器:PLC模块、工业传感器节点、远程监测设备,工业级温度+稳定频率确保数据准确;
  4. 消费电子终端:智能音箱、机顶盒、便携式游戏机,削峰正弦波降低音视频同步误差;
  5. 车载电子辅助:车机系统、ADAS模块(低温适配)、车载通信单元,宽温满足车载复杂场景。

五、品牌与可靠性保障

EPSON(爱普生)作为全球晶振核心供应商,拥有数十年研发制造经验,X1G0042110003继承品牌优势:

  • 一致性好:批量产品频率精度、参数一致性高,降低调试成本;
  • 可靠性高:通过温度循环、振动冲击等严苛测试,符合RoHS环保标准;
  • 技术支持完善:提供详细datasheet与应用指导,助力快速系统集成。

该产品凭借高精度、低功耗、宽温适配及小型化特性,成为多类电子设备的理想时钟源选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.