WMSIC Electronic Components

X1E0000210169

ModelX1E0000210169
PackageSMD3225-4P
BrandEPSON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EPSON X1E0000210169
Type
EPSON
Minimum package
2000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
EPSON
Electronic Component
X1E0000210169
Electronic Component
1
Package
SMD3225-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.048g
Frequency
32MHz
Electronic Component
1
Electronic Component
BM0264456444
Operating Temperature
40℃~+85℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EPSON X1E0000210169 贴片晶振产品概述

一、产品基本定位与核心身份

EPSON X1E0000210169是一款工业级贴片石英晶体谐振器,由全球知名晶振制造商爱普生(EPSON)出品。产品采用SMD3225-4P小型贴片封装,核心频率32MHz,针对宽温环境、高精度需求的电子设备设计,是工业控制、物联网终端、通信模块等场景的可靠时钟基准器件。

二、关键参数详解与实际意义

该产品的核心参数直接决定了其应用适配性,具体解读如下:

1. 频率与精度

  • 核心频率:32MHz(主流通用时钟频率,广泛兼容MCU、FPGA、蓝牙/Wi-Fi模块等主流芯片);
  • 常温频差±10ppm:25℃环境下,频率偏差不超过320Hz(计算方式:32MHz×10ppm=320Hz),精度优于多数消费级晶振(通常±20ppm),满足工业设备对时钟同步的基本要求。

2. 稳定性与环境适应性

  • 频率稳定度±20ppm:工作温度范围内(-40℃~+85℃),频率最大偏差为640Hz,覆盖工业级温差场景(如户外传感器、车载设备);
  • 工作温度范围:-40℃+85℃(符合IEC 60068工业标准,比消费级070℃更广,可应对极端低温/高温环境)。

3. 电气与封装特性

  • 负载电容12pF:晶振与外围电路的匹配关键,需并联12pF左右的NP0陶瓷电容(建议用两个6pF串联),避免频率偏移;
  • 等效串联电阻(ESR)40Ω:内阻处于同封装晶振的较低水平,起振容易、功耗低,减少电路噪声干扰;
  • 封装SMD3225-4P:3.2×2.5mm小型贴片(约指甲盖1/5大小),4引脚设计,适配高密度PCB布局,满足智能穿戴、小型传感器等紧凑设备需求。

三、品牌与品质保障

爱普生作为全球晶振领域的核心厂商,拥有50+年石英晶体技术积累,X1E0000210169延续了其高可靠性优势:

  • 经过振动(10~2000Hz,1.5g)、冲击(1000g/1ms)、老化(125℃×1000小时)等严苛测试;
  • 符合RoHS、REACH环保标准,量产一致性优异(批量应用故障率低);
  • 技术文档完整(含焊接温度曲线、匹配电容建议),降低工程师调试难度。

四、典型应用场景

结合参数特性,该晶振适用于以下核心场景:

  1. 工业自动化:PLC模块、传感器节点(宽温稳定,保障精准控制);
  2. 物联网终端:智能门锁、环境监测仪(小体积封装,适配紧凑设计);
  3. 通信设备:蓝牙5.0模块、Wi-Fi 6模块(32MHz兼容主流射频芯片,精度保障信号收发);
  4. 车载电子:仪表盘、车载T-BOX(-40~85℃适应车内温差,ESR低减少功耗);
  5. 消费电子:智能手表、运动手环(小体积不占用空间,精度满足时间同步/计步需求)。

五、设计与选型注意事项

工程师选型时需注意以下细节:

  1. 负载电容匹配:必须用12pF±5%的NP0电容(避免X7R等温度系数大的电容导致频率漂移);
  2. 焊接工艺:采用回流焊(峰值温度240~260℃,时间≤10秒),禁止手工焊接(易损伤晶体);
  3. 电路布局:晶振靠近MCU时钟引脚,走线短且远离射频干扰源,接地良好;
  4. 电源滤波:晶振电源端并联10μF电解电容+0.1μF陶瓷电容,减少电源噪声。

总结

EPSON X1E0000210169是一款平衡精度、稳定性与成本的工业级贴片晶振,凭借爱普生的技术积累和小体积、宽温特性,覆盖从工业控制到消费电子的多类场景,是工程师选型时钟基准器件的可靠选择。

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