Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
X1E0000210119
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- EPSON X1E0000210119
- Type
- EPSON
- Minimum package
- 2000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- EPSON
- Electronic Component
- X1E0000210119
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.042g
- Frequency
- 16MHz
- Electronic Component
- 1
- Electronic Component
- BM0264601949
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 12pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EPSON无源晶振X1E0000210119产品概述
##一、产品核心定位与基本属性
该产品为EPSON（爱普生）推出的无源贴片晶振，型号X1E0000210119，以16MHz为基准频率，适配SMD3225-4P标准贴片封装，是针对工业级、消费电子及物联网设备设计的高稳定性时钟源器件。无源晶振无内置振荡电路，需配合外部振荡模块（如MCU内置OSC）实现时钟输出，具有结构简单、可靠性高、抗干扰性强等特点，是电子设备中最常用的时钟基准之一。
##二、关键性能参数详解
- 频率与精度：基准频率为16MHz，常温下频率偏差控制在**±10ppm**（对应16MHz下误差±160Hz），满足大多数设备对时钟精准度的需求；频率稳定度（含温度、电压波动等综合因素）为**±20ppm**，确保不同环境下时钟信号一致性。
- 负载电容：标准负载电容为12pF，是无源晶振振荡电路的核心匹配参数——设计时需在晶振引脚与地并联总电容约12pF（通常用两个6pF陶瓷电容并联），若不匹配会导致频率偏移、启动困难。
- 等效串联电阻（ESR）：最大ESR为60Ω，ESR是晶振自身损耗电阻，数值越低则振荡启动越容易、信号幅度越稳定，60Ω在同类型16MHz晶振中属于低损耗水平。
- 工作温度范围：覆盖**-40℃~+85℃**，属于工业级温度规格，可适应户外、车载、工业控制等严苛场景，避免温度波动导致时钟失效。
##三、封装与物理特性
采用SMD3225-4P贴片封装，尺寸为3.2mm×2.5mm×0.8mm（长×宽×高），4引脚设计适配自动化SMT贴装，大幅节省PCB空间，尤其适合小型化设备（如可穿戴、物联网传感器）。封装材料为耐高温陶瓷，可承受回流焊高温工艺，且防潮、抗振动性能优异。
##四、可靠性与环境适应性
无源晶振无有源器件（晶体管、IC），可靠性远超有源晶振，平均无故障时间（MTBF）长；抗电磁干扰（EMI）能力强，适合复杂电磁环境（如工业现场、通信基站）；工作电压由外部电路决定，兼容性好；符合RoHS环保标准，不含铅、镉等有害物质。
##五、典型应用场景
- 物联网终端：智能传感器、智能家居网关等，16MHz时钟满足低功耗MCU需求，支持设备间时间同步；
- 工业控制：PLC、变频器、工业传感器等，-40℃~+85℃适配工业现场高低温；
- 可穿戴电子：智能手环、手表等，小封装实现设备小型化，精准时钟支持计步、心率校准；
- 通信模块：蓝牙、WiFi、LoRa模块等，16MHz为常用辅助时钟，配合主时钟实现信号收发同步；
- 消费电子：智能音箱、路由器、机顶盒等，稳定时钟确保系统运行流畅，避免功能异常。
X1E0000210119以高稳定、小封装、工业级特性，成为多领域电子设备的首选时钟基准，可满足从消费电子到工业应用的多样化需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
