Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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EPSON X1G0044810012是一款工业级通用型有源CMOS晶振,主打「宽电压兼容、低功耗、稳定抗扰」三大核心优势,专为需要精准时钟信号、同时对功耗和环境适应性有要求的电子设备设计。产品覆盖通信、工业控制、消费电子等多领域,可替代同规格传统晶振,平衡量产场景的成本与性能需求。
该晶振的参数精准匹配主流应用需求,具体解析如下:
标称频率为50MHz(数字电路、通信设备的常用时钟段);常温频差±50ppm(百万分之五十),换算实际频偏约±2.5kHz(50MHz×50×10⁻⁶),满足大部分数字系统的精度要求;全温频率稳定度±100ppm(-40℃~+85℃范围),覆盖工业级温度波动下的稳定输出,避免极端环境下的时钟漂移。
采用CMOS输出模式,信号电平与MCU、FPGA等常见数字芯片完全兼容,无需额外电平转换;工作电流仅2.6mA,在有源晶振中属于低功耗水平,适合电池供电的便携设备(如智能手环)或功耗敏感的工业模块。
工作电压范围1.62V~3.63V,覆盖1.8V、3.3V等主流系统电压,可直接适配不同平台的电源设计;工作温度-40℃~+85℃,符合工业级设备的环境要求,能在低温(北方户外)、高温(车间控制柜)场景下稳定运行。
产品采用SMD7050-4P封装(7.0mm×5.0mm×1.5mm),属于小型化贴片封装,节省PCB空间,适合高密度布局的设备;4引脚配置遵循行业通用设计:
引脚间距与焊盘尺寸符合IPC标准,便于自动化贴片生产,降低焊接不良率。
作为EPSON(爱普生) 旗下产品,该晶振继承日系品牌的品质优势:
该晶振的多优势叠加,使其适配以下场景:
EPSON X1G0044810012作为一款工业级有源CMOS晶振,以「50MHz精准频率+宽电压兼容+低功耗+工业温宽」为核心,适配多领域应用需求。结合EPSON的品牌品质,是量产设备中替代传统晶振的可靠选择,参数覆盖主流设计需求,封装小巧易布局,适合对时钟精度、功耗和环境适应性有平衡要求的电子设备。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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