Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
这款由爱普生(EPSON)推出的X1G0044510008是一款专为数字电路设计的有源CMOS晶振,凭借稳定的频率特性、宽适配性和小型化封装,广泛应用于便携电子、IoT模块、工业控制等场景。
X1G0044510008属于EPSON的工业级有源晶振系列,核心频率为50MHz,输出模式为CMOS电平,封装采用SMD5032-4P(5.0×3.2×1.0mm表面贴装4引脚)。作为有源晶振,它无需外部振荡电路,直接输出稳定时钟信号,简化了电路设计,降低了系统复杂度。
采用SMD5032-4P表面贴装封装,尺寸为5.0mm(长)×3.2mm(宽)×1.0mm(高),体积小巧,能显著节省PCB空间,适合紧凑设计的终端产品(如IoT传感器节点、智能手表主板)。4引脚布局符合行业标准,支持自动化贴片生产,提高生产效率;同时封装的抗振动(≥10g)、抗冲击(≥100g)性能,满足工业级设备的机械应力要求。
X1G0044510008符合工业级可靠性标准,全温度范围内无跳频、失锁现象;表面贴装封装抗机械应力能力强,能承受运输和使用中的振动冲击;同时,EPSON的晶振制造工艺经过长期验证,确保产品在复杂环境下的稳定运行,适合对可靠性要求较高的场景。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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