Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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EPSON X1G0041710031是一款24MHz CMOS输出的小型贴片有源晶振,针对对体积、功耗、宽电压范围有明确要求的数字电路设计,兼顾工业级温宽与高稳定性,可广泛适配单片机、通信模块、工业控制及消费电子等场景,是平衡性能与成本的通用型时钟源方案。
该晶振基准频率为24MHz,常温(25℃)频差严格控制在±50ppm以内——换算为实际频率偏差仅±1.2kHz(24MHz×50×10⁻⁶),满足大多数数字系统对时钟精度的核心需求(如通信协议同步、单片机时序控制、ADC采样时钟等)。
采用CMOS输出模式,输出电平与TTL/LVCMOS逻辑电平完全兼容,无需额外缓冲电路即可直接驱动微控制器(MCU)、FPGA、射频芯片等数字/混合信号器件,显著简化电路设计与物料成本。
工作电压范围覆盖1.62V~3.63V,可无缝适配1.8V(电池供电设备)、3.3V(工业/通信设备)等主流电源系统,无需额外电压转换电路,提升系统设计灵活性。
采用SMD2520-4P封装,尺寸仅2.5mm×2.0mm(长宽),厚度符合行业标准(约0.8mm),适合对PCB空间要求严格的场景:
4引脚贴片结构遵循有源晶振通用定义(通常含VCC电源脚、GND接地脚、OUT时钟输出脚、NC空脚),焊接兼容性好,可通过标准SMT工艺批量生产,降低生产难度。
工作温度范围为**-40℃~+85℃**,覆盖以下典型场景:
典型工作电流仅2.2mA,在电池供电的便携设备中可有效延长续航时间(如智能手环、便携式医疗设备),同时满足低功耗系统的电流预算要求(如物联网终端的待机+工作电流平衡)。
作为EPSON爱普生旗下的有源晶振产品,依托爱普生在石英晶体领域的50+年技术积累,采用高精度石英振子与稳定的振荡电路设计,确保长期工作的频率稳定性(如10年老化率控制在±20ppm以内,可合理推测,符合行业标准);同时符合RoHS环保标准,满足全球市场的合规要求,降低供应链风险。
该产品以“小型化、宽电压、低功耗、工业级温宽”为核心优势,可有效解决数字系统中时钟源的兼容性与可靠性问题,是多场景通用的高性价比时钟方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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