WMSIC Electronic Components

ESPRESSIF ESP32-S3 ESP32

ModelESP32-S3
PackageQFN-56-EP(7x7)
BrandESPRESSIF
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
ESPRESSIF ESP32-S3
Type
ESPRESSIF
Minimum package
2000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ESPRESSIF
Electronic Component
ESP32-S3
Electronic Component
1
Package
QFN-56-EP(7x7)
Type
Transceiver
Electronic Component
Wireless Transceiver IC
Electronic Component
0.19g
Electronic Component
98.4dBm
Electronic Component
1
Features
positions
Current
340mA
Electronic Component
BM0264576594
Operating Temperature
40℃~+105℃
Operating Voltage
3V~3.6V
Electronic Component
WiFi

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESP32-S3 产品概述

一、概述

ESP32-S3 是一款来自乐鑫(ESPRESSIF)的集成型无线收发器SoC,封装为 QFN-56-EP(7×7mm)SMD 封装。芯片集成双核处理器与 512 KB SRAM,支持 Wi‑Fi 与 Bluetooth BLE 协议,工作在 2.4 GHz 频段(2.412 GHz ~ 2.484 GHz),适合对无线连接与边缘计算有较高集成度要求的嵌入式应用。

二、主要无线与性能指标

  • 频率范围:2.412 GHz ~ 2.484 GHz(2.4 GHz Wi‑Fi/BLE)
  • 输出功率:21 dBm(典型)
  • 最大数据速率:150 Mbps(Wi‑Fi)
  • 接收灵敏度:-98.4 dBm
  • 类型:收发器(SoC)

三、供电与功耗

  • 工作电压:3.0 V ~ 3.6 V
  • 发射电流(TX):约 340 mA
  • 接收电流(RX):约 88 mA
  • 工作温度范围:-40 ℃ ~ +105 ℃

四、外设接口与功能

芯片提供丰富的外设接口,便于系统集成:

  • ADC、SPI、PWM、I2C、I2S、USB、UART
  • 支持软件复位(software reset) 这些接口覆盖了传感器、音频、存储、外设控制与主机通信等应用需求。

五、封装与系统集成建议

  • 封装:QFN-56-EP(7×7 mm),适合 SMD 批量贴装。
  • 天线与射频:工作在 2.4 GHz,需配合适配的射频匹配网络、滤波器与 PCB 天线或外置天线接口,注意射频地平面与走线。
  • 电源与去耦:建议在供电引脚附近放置低 ESR 电容与陶瓷去耦,保证 TX 峰值电流供给与 EMI 控制。
  • 散热与布局:在高发射功率与工业温度范围应用中,注意底部焊盘放热与周边金属件干扰。

六、典型应用场景

适用于智能家居、物联网网关、无线传感、可穿戴设备、工业监测与需要低功耗无线通信和丰富外设的边缘终端。

总结:ESP32‑S3 以其 2.4 GHz Wi‑Fi/ BLE 能力、21 dBm 发射功率、完整的外设接口和工业级工作温度,适合对无线性能与系统集成度有实际需求的中小型嵌入式产品开发。

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