WMSIC Electronic Components

EXAR SP3088EEN-L/TR SP3088EEN

ModelSP3088EEN-L/TR
PackageSOIC-8
BrandEXAR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
EXAR SP3088EEN-L / TR
Type
EXAR
Minimum package
2500

Technical parameters

Electronic Component
EXAR
Electronic Component
SP3088EEN-L/TR
Electronic Component
1
Package
SOIC-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.24g
Electronic Component
256
Electronic Component
1
Features
Tx / Rx;;;; Low Power
Electronic Component
BM0230663417
Operating Temperature
40℃~+85℃
Operating Voltage
4.5V~5.5V
Receiver
1
Data
20Mbps
Communication
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP3088EEN-L/TR 产品概述

一、简介

SP3088EEN-L/TR 是艾科嘉(EXAR)推出的一款高可靠性差分收发器,集成 1 路驱动器与 1 路接收器,专为工业级多节点半双工差分通信设计。器件在宽工作电压、低静态功耗与高静电防护间取得平衡,适用于需稳定长线传输与多节点连接的场景。

二、主要特性

  • 工作电压:4.5V ~ 5.5V,兼容典型 5V 系统。
  • 数据速率:最高 20 Mbps,支持高速差分数据传输。
  • 驱动/接收通道:1 个驱动器、1 个接收器,半双工通信模式。
  • 多节点支持:最多可支持 256 节点的总线结构,适合大规模分布式系统。
  • 静态电流:典型值 400 μA,适合对待机功耗敏感的应用。
  • 静电保护:对 I/O 引脚提供 ±15 kV(接触放电)级别的 ESD 防护,提升系统可靠性。
  • 工作温度范围:-40℃ 至 +85℃,满足工业环境要求。
  • 封装:标准 SOIC-8 封装,便于 PCB 布局与生产装配。

三、电气与环境参数要点

SP3088EEN-L/TR 在 4.5V–5.5V 电源下工作,设计时建议在 VCC 近端放置一个 0.1 μF 陶瓷旁路电容以抑制瞬态噪声。器件静态电流约 400 μA,有利于降低系统待机功耗;但在高数据率或重载驱动时应关注瞬态电流与热耗散。-40℃~+85℃ 的温度额定适用于多数室外或工控场合。器件总线引脚具有高达 ±15 kV 的 ESD 抗扰能力,能提高系统对现场静电放电的免疫性。

四、典型应用场景

  • 工业现场总线与分布式控制系统;
  • 多节点数据采集与传感器网络;
  • 工程机械、楼宇自控与电力监控通信接口;
  • 任何需在恶劣环境下实现高可靠差分半双工通讯的场合。

五、设计与布局建议

  • 差分对走线尽量成对且等长,减少串扰与抖动。
  • 在总线两端使用终端电阻以匹配特性阻抗,避免反射。
  • 对于多节点系统,采用偏置(fail-safe)电阻以确保空闲状态的确定性。
  • VCC 必须靠近器件放置去耦电容;信号回流路径要短且连贯,减少环路面积。
  • 考虑外部 TVS 或额外的过压保护以应对瞬态电压冲击,进一步提升系统稳健性。

六、封装与订购信息

  • 品牌:EXAR(艾科嘉)。
  • 型号:SP3088EEN-L/TR。
  • 封装:SOIC-8,卷带盘装(Tape & Reel)适合自动贴片生产。
    在选型时可根据目标系统的总线拓扑和电磁兼容要求,配合合适的外部终端与保护元件,确保长期可靠运行。

总结:SP3088EEN-L/TR 以其工业级温度范围、较高的数据速率、低静态功耗与强 ESD 防护,适合要求稳定、多节点半双工差分通信的工业与嵌入式应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.