Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SP708TEN-L/TR 是一款高效能的电压监控和复位芯片,由知名品牌 EXAR(艾科嘉)制造。该芯片采用 8-SOIC 封装,表面贴装(SMT)设计,适合空间受限的电子产品中使用。它的主要功能是监控供电电压,确保在电压低于设定阈值时自动复位,以保护电路和设备的正常运行。
监控电压与复位功能: SP708TEN-L/TR 能够在单一电压监控下工作,其阈值电压为 3.08V。当电压低于该阈值时,芯片将触发复位功能,确保系统稳定性。
复位信号类型: 该芯片支持高有效和低有效的复位信号选择,给设计者提供了灵活性,以符合不同电路的需求。默认情况下,此芯片设计为低电平有效(即,当复位信号处于低电平时,系统复位触发)。
复位超时: SP708TEN-L/TR 提供最小 140ms 的复位超时,这意味着在电压恢复正常后,信号将在 140ms 后被释放,确保系统有足够时间稳定下来,再恢复正常操作。
广泛的工作温度范围: 该芯片可在 -40°C 到 85°C 的环境温度下稳定工作,符合宽温度应用的需求,广泛适用于工业、汽车及其他严苛环境中。
封装设计: 使用 8-SOIC 封装,尺寸为 0.154"(3.90mm 宽)使其在紧凑的电路板设计中具有极好的适用性。这种表面贴装封装简化了生产过程,提高了组装效率。
SP708TEN-L/TR 具有广泛的应用范围,尤其适用于下列场合:
相较于市场上同类产品,SP708TEN-L/TR 的高效能和灵活性使其在多个应用中表现优异。其高可靠性及耐用性使得它在严苛环境下的表现更加出色,充分满足了现代电子产品对稳定性的高要求。
SP708TEN-L/TR 是一款专为现代电子设备设计的电压监控与复位芯片,以其高阈值电压、灵活的复位逻辑、长时间的超时机制和宽工作温度范围,赢得了设计师们的青睐。无论在消费电子、工业自动化还是汽车电子领域,这款芯片都能提供可靠的电压监控与复位解决方案,确保电路功能的稳定与安全。随着电子产品对高性能电源管理的要求不断提升,SP708TEN-L/TR 将继续发挥重要作用。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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