WMSIC Electronic Components

FH 0201X104K160NT

Model0201X104K160NT
Package0201
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
FH 0201X104K160NT
Type
FH
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0201X104K160NT
Electronic Component
1
Electronic Component
100nF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.01g
Electronic Component
1
Electronic Component
BM0257283085
Electronic Component
X5R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201 X104K160NT 产品概述

一、产品概述

0201 X104K160NT 为风华(FH)系列超小型贴片多层陶瓷电容(MLCC),标称容量 100nF(104),公差 ±10%(K),额定电压 16V,介质材料 X5R。该件面向高密度、体积受限的现代电子产品,提供稳健的去耦与滤波功能,是移动终端、可穿戴设备和 IoT 终端等微型化电路常用元件。

二、主要电气参数

  • 容量:100 nF(104)
  • 公差:±10%(K)
  • 额定电压:16 V DC
  • 介质:X5R(工作温度范围 -55°C ~ +85°C,容量温度特性受限于 X5R 规范,通常在该温度范围内容量变化不超过 ±15%)
  • 封装:0201(超小型封装,具体外形尺寸请以厂家数据表为准)

三、关键性能与注意点

  • DC-bias 效应:高介电常数材料在施加直流偏压时会出现容量下降,0201 小封装尤为明显,设计时应评估工作电压下的实际有效容量。
  • 老化现象:陶瓷介质存在老化,容量随时间逐步下降,首次阶段下降较快,长期趋于稳定;在关键容差场合需考虑老化补偿或预老化处理。
  • 低 ESR/低 ESL:相比电解电容,MLCC 在高频去耦上表现优越,但对于精密计时或超高稳定场合,需优先选 C0G/NP0 类陶瓷。

四、封装与包装

  • 超小 0201 封装适用于高密度贴片 PCB。
  • 常见包装形式为卷带(Tape & Reel),适配自动贴片机;具体盘带数量与包装规格请以厂家物料清单或数据表为准。

五、典型应用场景

  • MCU/SoC 电源去耦与旁路滤波
  • 高频电源滤波、射频前端旁路(非高精度 RF 调谐)
  • 手机、耳机、可穿戴设备、微型传感器与 IoT 芯片组电源隔离
  • 空间受限的消费电子与医疗电子模块

六、PCB 布局与装配建议

  • 靠近被去耦芯片的电源引脚放置,走线尽量短与宽,减小回路面积。
  • 对于大电流或低噪声要求,建议多只电容并联以降低等效阻抗。
  • 0201 尺寸脆弱,避免在电容端部与 PCB 上产生应力集中(如过大的焊盘伸出、违规的板弯),建议按厂方推荐焊盘尺寸并控制回流曲线。
  • 贴装过程中注意识别与抓取,视觉识别与真空吸嘴需匹配 0201 尺寸公差。

七、可靠性与焊接储存建议

  • 按厂家推荐的回流温度曲线(JEDEC 标准或厂方曲线)进行焊接,避免多次高温循环和快速冷却造成热机械应力。
  • 存储避免潮湿、高温与剧烈振动,贴片前遵循抗潮包装与烘烤要求以防焊接缺陷。
  • 在机械振动或弯曲应力较大的应用中,应评估是否需要封装加固或选用更大尺寸封装以提高可靠性。

八、选型提示

  • 若需极高温度稳定性或极低介电损耗,考虑 C0G/NP0 系列替代;若工作电压较高或对 DC-bias 敏感,请评估在实际工作电压下的有效容量并增加裕量。
  • 采购时以风华数据表为准,核对批次、温度等级与包装形式。需要我帮您查找完整数据表或推荐替代型号,可提供具体应用场景与电路要求。

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