WMSIC Electronic Components

FH 0402X104K500NT

Model0402X104K500NT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
FH 0402X104K500NT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0402X104K500NT
Electronic Component
1
Electronic Component
100nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.022g
Electronic Component
1
Electronic Component
BM0231139262
Electronic Component
X5R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402X104K500NT — 0402 尺寸 X5R 100nF ±10% 50V 片式陶瓷电容 产品概述

一、产品简介

0402X104K500NT 为风华(FH)系列片式多层陶瓷电容器,额定电容 100nF(0.1µF)、公差 ±10%、额定电压 50V,温度特性为 X5R,封装 0402(公制 1005)。该器件体积微小、可靠性高,适合高密度表面贴装(SMT)电路板,用于去耦、旁路与高频滤波等场景。

二、主要特性与电气参数

  • 容值:100nF(0.1µF)
  • 精度:±10%(标称)
  • 额定电压:50V DC
  • 温度特性:X5R(工作温度范围大致 −55℃ 到 +85℃,典型温度范围内电容变化受限于规格)
  • 封装:0402(尺寸极小,适合高密度设计)
  • 品牌:FH(风华)
    说明:X5R 型陶瓷在温度和偏压下会有一定电容变化,尤其在高偏压下直流偏置效应明显,设计时应参考厂商数据手册中的温漂与直流偏置曲线。

三、典型应用场景

  • 电源去耦与旁路:微控制器、射频模块、模拟前端等局部去耦,提供快速瞬态响应。
  • 高频滤波:抑制电磁干扰与电源噪声,配合电感构成滤波网络。
  • 移动与便携设备:空间受限的消费电子、穿戴设备与物联网终端。
  • 精密模拟电路:在要求体积小且容值稳定的场合作旁路或耦合(需注意温漂与偏压影响)。

四、设计与布局注意事项

  • 布局靠近电源引脚或芯片供电引脚放置,以最小化寄生电感与走线阻抗。
  • 对称焊盘与合适的焊膏量可以降低墓碑效应(tombstoning)风险。建议采用厂商推荐的 PCB land pattern。
  • 考虑直流偏置效应:在高工作电压下实际可用电容会下降,需按实际偏压与温度条件预留裕量。
  • 多个 0402 电容并联可减小等效串联电阻(ESR)与等效串联电感(ESL),改善滤波性能。

五、焊接与可靠性建议

  • 建议采用无铅回流焊工艺,并遵循器件回流温度曲线(峰值温度与保温时间按厂商手册)。
  • 避免在焊接过程中对器件施加过大机械应力或快速冷却,以免发生裂纹。
  • 存放与贴装应注意防潮防静电,遵循厂商包装与 MSL(若标注)要求。
  • X5R 属介质型陶瓷,对振动和热循环有良好耐受性,但过度弯曲或局部受力仍可能导致失效,应在设计阶段考虑应力释放。

六、采购与替代建议

  • 该型号常见为卷带包装,适合高速贴装机使用;下单时确认包装规格与供货批次。
  • 若需替代,可在相同性能(0402、100nF、±10%、50V、X5R)下选择其他品牌,但应比对直流偏置曲线、温漂与可靠性试验数据以确保电路性能一致。
  • 量产前建议索取器件样品并进行电路级测试,包含温度漂移、偏压依赖与寿命试验,确保满足最终应用要求。

如需我帮忙对比具体替代件或解读风华官方数据手册中的偏压/温漂曲线,提供 PCB 布局示意或回流曲线建议,可把相关资料或应用场景发来。

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