Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FH 0603B104K160NT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0603B104K160NT
- Type
- FH
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0603B104K160NT
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0227583880
- Electronic Component
- X7R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603B104K160NT 产品概述
一、产品简介
0603B104K160NT 为风华（FH）系列多层陶瓷贴片电容（MLCC），额定电压16V，容值100nF（104），公差±10%，温度系数X7R。0603封装（约1.6 × 0.8 mm）体积小、性能稳定，适合高密度贴片电路。
二、主要参数
- 容值：100 nF（±10%）
- 额定电压：16 V DC
- 温度特性：X7R（-55°C 至 +125°C 下电容变化通常在可接受范围）
- 封装：0603（1608公制）
- 品牌：FH（风华）
三、性能特点
- 温度稳定性良好，适用宽温区间的去耦与旁路。
- 介质容量密度高，体积小但有良好滤波与去耦能力。
- 低等效串联电阻（ESR）和良好的频率响应，满足高速数字与模拟电路需求。
- X7R介质相对低老化，长期稳定性优于Y5V类材料。
四、典型应用
- 电源旁路与降噪（DC-DC、LDO输出侧）
- 数字IC去耦（MCU、FPGA、SoC）
- 高频滤波、电源滤波网络与耦合/隔直应用
- 消费电子、通信设备、工业控制与汽车电子（在工作温度范围内）
五、设计与贴装建议
- 建议遵循J-STD-020再流焊规范进行回流焊，峰值温度按元件与PCB材料要求控制（常见≤245°C）。
- 使用自动贴片机与卷带供料，确保贴装精度与速度。
- 贴装时避免元件受到机械应力或PCB弯曲，焊后冷却应均匀，避免热冲击。
- 设计上对关键电源去耦可考虑并联多个电容以覆盖宽频带并降低ESR/ESL。
六、可靠性与注意事项
- X7R为介质型MLCC，会受直流偏压影响（DC bias），在高电场下有效电容可能下降，设计时应评估工作电压下的实际电容。
- 对于必须长期稳定的参考或计时电路，慎用容差与温漂受限的MLCC。
- 储存与清洗注意避免潮湿与强酸碱溶剂，必要时采用经认证的清洗工艺。
七、包装与订购信息
通常以卷带（Tape & Reel）形式供货，便于SMT贴装。具体包装规格、最小起订量和交付时间请向供应商或经销商确认。
八、技术支持与选型建议
在电压依赖、温度范围或频率响应为关键参数的设计中，建议向供应商索取样品及器件数据表、温漂曲线与DC-bias特性图，以便在PCB布局与元件并联策略上做出最佳选型。若需替代型号或更高电压/更小温漂的器件，可根据应用场景调整材质与封装。
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