Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
该型号为风华电子(FH)推出的温度补偿型多层陶瓷贴片电容(MLCC),命名规则清晰对应核心参数:
本质是一款高稳定、小体积、中低压的精密MLCC,适配对容值一致性要求严苛的场景。
该型号的性能聚焦于「温度/电压稳定性」与「高频低损耗」,核心参数如下:
性能维度 具体参数 优势解读 容值与精度 33pF ±5%(J级) 满足精密电路对容值一致性的要求 额定电压 50V DC 中低压场景余量充足,避免电压击穿 温度系数 C0G(≤±30ppm/℃,-55~125℃) 温度变化对容值影响可忽略(≤0.005pF) 高频损耗 tanδ≤0.15%(1kHz) 射频/高频电路无额外能量损耗 无极性设计 两端无正负区分 焊接无需极性判断,简化生产流程采用SMD0201小型化封装,适配高密度PCB设计:
C0G(NP0)是温度补偿型陶瓷的核心,其容值稳定性远优于X7R、Y5V等高容值材料:
该型号因「小体积+高稳定」,广泛用于以下场景:
风华作为国内MLCC龙头,该型号通过多重可靠性验证:
若需调整参数,可参考以下替代方案:
该型号以「高稳定、小体积、性价比优」为核心竞争力,是精密电子电路中替代进口同类型号的可靠选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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