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FH 0402X225K160NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0402X225K160NT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0402X225K160NT
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.014g
- Electronic Component
- 1
- Electronic Component
- BM0257283216
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402 X225K160NT（FH风华）产品概述
一、产品简介
0402 X225K160NT 是风华（FH）生产的一款多层陶瓷贴片电容（MLCC），标称容量 2.2µF，基准容差 ±10%（K），额定电压 16V，介质为 X5R。封装为 0402（约 1.0 × 0.5 mm），适用于对体积和滤波去耦要求较高的小型化电子产品。
二、主要电气与温度特性
- 标称容量：2.2µF（±10%）
- 额定电压：16 V DC
- 介质特性：X5R（工作温度范围 -55°C ~ +85°C，温度范围内容值变化通常在 ±15% 以内）
- ESR/ESL：典型 MLCC 具有低等效串联电阻和低等效串联电感，适合高频去耦与旁路应用 说明：X5R 属陶瓷介质，随温度和直流偏压（DC-bias）容值会变化，实际工作容值应参考厂商给出的温度与偏压特性曲线。
三、封装与机械注意事项
0402 为极小尺寸封装，适合高密度 PCB 布局。玻璃化陶瓷材料在焊接和机械应力下易产生微裂纹，建议：
- 采用贴片回流焊工艺，按厂商推荐回流曲线（峰值温度建议在厂方资料范围内，通常 ≤ 260°C）；
- 贴装时避免过大的印刷锡膏量和不均匀焊盘；遵循推荐的焊盘尺寸与焊膏模板；
- PCB 弯曲或机械应力应最小化，尤其在振动和热循环环境。
四、典型应用场景
- 嵌入式 SoC、MCU、电源稳压器的去耦与旁路
- 手机、可穿戴设备、物联网终端等高密度移动设备
- 滤波、耦合电路及高频旁路场合 说明：由于 X5R 的 DC-bias 效应，作为储能元件或对稳定容量要求严格的滤波器时，应评估在工作电压下的有效容量。
五、设计与选型建议
- DC-bias 和温度依赖性：在电源轨上使用时，设计应留有裕量并参考器件数据手册中的容值随电压/温度的变化曲线；
- 容差与数量：±10% 容差适合一般去耦，若需更严格的容值稳定性，可考虑并联多颗电容或选用更高等级介质；
- 可靠性与替代：0402 高容值型号在长期热循环和机械振动下比大封装更敏感，关键应用建议进行加速寿命验证。可根据 FH 数据对比 Murata、TDK 等厂商同类规格作为替代件。
六、包装与采购
常见为卷带（Tape & Reel）包装，便于自动贴片生产线使用。订购时注意型号完整性（容量-容差-额定电压-介质-封装-批次），并索取器件的规格书与 DC-bias、寿命测试数据以支撑可靠性评估。
总结：0402 X225K160NT 提供在极小尺寸下较高的电容量，适合高密度电子设备的去耦与滤波需求，但需在设计时充分考虑 X5R 的温度与直流偏压特性，以及 0402 封装的机械可靠性限制。
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