WMSIC Electronic Components

FH 0201CG4R3C500NT

Model0201CG4R3C500NT
Package0201
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
FH 0201CG4R3C500NT
Type
FH
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0201CG4R3C500NT
Electronic Component
1
Electronic Component
4.3pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.008g
Electronic Component
10
Electronic Component
BM0265117059
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201CG4R3C500NT 贴片多层陶瓷电容(MLCC)产品概述

一、产品基本定义与品牌背景

0201CG4R3C500NT是风华电子(FH) 推出的一款0201封装贴片多层陶瓷电容(MLCC),属于C0G(NP0)高频低损耗系列。风华电子作为国内MLCC行业龙头企业,拥有30余年专业经验,具备成熟的多层共烧工艺与稳定产能,产品覆盖消费电子、通信、工业等多领域,符合RoHS 2.0、REACH等环保标准,可靠性经市场长期验证。

二、核心参数与封装规格

该产品核心参数精准匹配高频精密电路需求,具体如下:

参数项 规格描述 标称容值 4.3pF(典型值) 容值精度 ±0.25pF(C0G介质典型精度) 额定电压 50V DC(直流电压) 温度系数 C0G(EIA标准,对应IEC NP0,±30ppm/℃) 工作温度范围 -55℃ ~ +125℃ 封装尺寸(0201) 英制0.02″×0.01″(公制0.6mm×0.3mm) 介质类型 NP0(C0G)陶瓷介质 损耗角正切(tanδ) ≤0.001(1kHz,25℃)

注:具体参数以风华官方datasheet为准。

三、性能特点

3.1 宽温容值稳定性优异

C0G介质温度系数仅±30ppm/℃,在-55℃至+125℃范围内,容值变化率≤±0.1%,可满足振荡回路、射频耦合等精密电路对容值稳定的要求,避免温度波动导致的信号偏差。

3.2 高频损耗极低

相比X7R、Y5V等中高压介质,C0G介质损耗角正切(tanδ)低至0.001(1kHz),能有效减少高频信号衰减,提升蓝牙、WiFi等射频电路的传输效率。

3.3 小型化集成优势

0201封装体积仅约0.6mm×0.3mm×0.3mm,比0402封装缩小60%以上,可大幅提升电路集成密度,适配智能手机、智能穿戴等便携设备的小型化需求。

3.4 电压容量匹配合理

50V额定电压覆盖中低压电路主流需求,4.3pF小容值适合高频耦合、谐振回路等场景,避免大容值带来的寄生电感/电阻影响。

3.5 可靠性与一致性

采用风华多层共烧工艺,电极与陶瓷介质结合紧密,抗机械振动、温度冲击性能优异,批量产品一致性符合IEC 60384-1标准。

四、典型应用场景

该产品因“稳定、低损、小型化”特性,广泛应用于:

  1. 射频通信设备:蓝牙、WiFi、5G小基站模块的信号耦合电容、谐振回路电容;
  2. 便携式电子:智能手机射频前端、智能手表传感器信号调理电路;
  3. 工业仪器仪表:高精度温度传感器、晶体振荡器的负载电容(宽温稳定需求);
  4. 汽车电子辅助系统:若通过AEC-Q200认证,可用于车载蓝牙、胎压监测模块(需确认车规版本);
  5. 高频振荡电路:压控振荡器(VCO)、晶体振荡器的匹配电容,保证振荡频率稳定。

五、可靠性与环境适应性

风华MLCC经过严格测试,确保长期可靠性:

  • 温度循环:-55℃~125℃循环1000次,容值变化率≤±0.5%;
  • 湿度测试:85℃/85%RH环境下1000h,性能无明显衰减;
  • 振动测试:10~2000Hz振动,加速度1.5g,无开路/短路故障;
  • 耐电压测试:1.5倍额定电压(75V DC)测试1s,无击穿。

六、选型与使用注意事项

  1. 精度匹配:振荡电路需确认容值精度是否满足设计要求(如±0.1pF);
  2. 电压降额:实际工作电压建议不超过额定电压的80%(40V DC),延长寿命;
  3. 焊接工艺:回流焊峰值温度≤260℃,焊接时间≤10s,避免热应力损伤;
  4. 静电防护:MLCC易受静电损坏,需在ESD防护环境下操作(佩戴静电手环);
  5. 存储条件:常温干燥环境(15~35℃,湿度≤60%),避免受潮影响焊接性能。

如需详细参数或车规版本信息,可查阅风华电子官方技术文档。

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