Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201CG4R3C500NT是风华电子(FH) 推出的一款0201封装贴片多层陶瓷电容(MLCC),属于C0G(NP0)高频低损耗系列。风华电子作为国内MLCC行业龙头企业,拥有30余年专业经验,具备成熟的多层共烧工艺与稳定产能,产品覆盖消费电子、通信、工业等多领域,符合RoHS 2.0、REACH等环保标准,可靠性经市场长期验证。
该产品核心参数精准匹配高频精密电路需求,具体如下:
参数项 规格描述 标称容值 4.3pF(典型值) 容值精度 ±0.25pF(C0G介质典型精度) 额定电压 50V DC(直流电压) 温度系数 C0G(EIA标准,对应IEC NP0,±30ppm/℃) 工作温度范围 -55℃ ~ +125℃ 封装尺寸(0201) 英制0.02″×0.01″(公制0.6mm×0.3mm) 介质类型 NP0(C0G)陶瓷介质 损耗角正切(tanδ) ≤0.001(1kHz,25℃)注:具体参数以风华官方datasheet为准。
C0G介质温度系数仅±30ppm/℃,在-55℃至+125℃范围内,容值变化率≤±0.1%,可满足振荡回路、射频耦合等精密电路对容值稳定的要求,避免温度波动导致的信号偏差。
相比X7R、Y5V等中高压介质,C0G介质损耗角正切(tanδ)低至0.001(1kHz),能有效减少高频信号衰减,提升蓝牙、WiFi等射频电路的传输效率。
0201封装体积仅约0.6mm×0.3mm×0.3mm,比0402封装缩小60%以上,可大幅提升电路集成密度,适配智能手机、智能穿戴等便携设备的小型化需求。
50V额定电压覆盖中低压电路主流需求,4.3pF小容值适合高频耦合、谐振回路等场景,避免大容值带来的寄生电感/电阻影响。
采用风华多层共烧工艺,电极与陶瓷介质结合紧密,抗机械振动、温度冲击性能优异,批量产品一致性符合IEC 60384-1标准。
该产品因“稳定、低损、小型化”特性,广泛应用于:
风华MLCC经过严格测试,确保长期可靠性:
如需详细参数或车规版本信息,可查阅风华电子官方技术文档。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products