Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
风华0201CG1R2B500NT是一款0201封装的贴片多层陶瓷电容(MLCC),由国内头部电子元器件厂商风华高科(FH)研发生产,属于C0G温度稳定型系列核心产品。其型号命名遵循行业通用规则,可快速识别关键属性:
该产品定位为高频低损耗小容量电容,核心优势在于容值稳定、损耗极低,广泛适配射频、精密模拟等对信号精度要求苛刻的场景。
采用NP0(C0G)类陶瓷介质,介电常数约30~60,是温度稳定型电容的代表:
0201封装体积仅为0.6mm×0.3mm×0.3mm,比0402封装小约60%,可显著提升PCB布局密度,适配智能手机、可穿戴设备等小型化产品。
MLCC无极性设计,无需区分正负端,可直接贴装于PCB任意焊盘,简化生产流程,降低装配错误率。
0201封装电容对静电敏感(ESD敏感度≤2kV),生产/测试过程需:
焊盘尺寸建议为0.3mm×0.4mm(长×宽),焊盘间距0.2mm,避免焊盘过大导致焊接后电容偏移。
风华0201CG1R2B500NT是一款高稳定、低损耗、小体积的MLCC,凭借C0G介质的温度稳定性和0201封装的高密度适配性,成为射频、精密模拟电路的优选元件。其符合RoHS标准的无铅设计,也适配当前电子产业的环保要求,可广泛应用于消费电子、通信、工业控制等领域,是替代进口小容量C0G电容的高性价比选择。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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