WMSIC Electronic Components

FH 0201CG1R2B500NT

Model0201CG1R2B500NT
Package0201
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

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Technical data

Product details

17 specifications

Core information

Product name
FH 0201CG1R2B500NT
Type
FH
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0201CG1R2B500NT
Electronic Component
1
Electronic Component
1.2pF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
0.008g
Electronic Component
10
Electronic Component
BM0265117010
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

风华0201CG1R2B500NT贴片多层陶瓷电容(MLCC)产品概述

一、产品基本信息

风华0201CG1R2B500NT是一款0201封装的贴片多层陶瓷电容(MLCC),由国内头部电子元器件厂商风华高科(FH)研发生产,属于C0G温度稳定型系列核心产品。其型号命名遵循行业通用规则,可快速识别关键属性:

  • 0201:英制封装尺寸(0.02英寸×0.01英寸,对应公制0.6mm×0.3mm),适配高密度PCB设计;
  • CG:温度系数标识(EIA标准C0G,对应IEC标准NP0),代表容值温度稳定性优异;
  • 1R2:标称容值(“R”为小数点,即1.2pF);
  • B500:额定电压(50V直流);
  • NT:风华内部编号,对应端电极结构(典型为镍+锡无铅镀层)。

该产品定位为高频低损耗小容量电容,核心优势在于容值稳定、损耗极低,广泛适配射频、精密模拟等对信号精度要求苛刻的场景。

二、核心技术参数

参数项 具体指标 备注 标称容值 1.2pF 典型容差±0.1pF(以官方datasheet为准) 额定电压 50V DC 交流应用需降额(峰值≤35V AC) 温度系数 C0G(NP0) ≤±30ppm/℃(-55℃~+125℃) 封装尺寸 0201(英制) 长0.6±0.03mm,宽0.3±0.03mm,厚0.3±0.03mm 损耗角正切(tanδ) ≤0.0001(1kHz);≤0.0002(1MHz) 高频下损耗可忽略,无额外发热 工作温度范围 -55℃ ~ +125℃ 宽温环境适应性强,适配工业/车载场景 谐振频率(fr) 典型≥10GHz(1.2pF小容量特性) 完美适配射频微波频段 绝缘电阻 ≥10^12Ω(25℃,10V DC) 高绝缘性减少信号泄露

三、材料与性能优势

1. C0G介质的核心优势

采用NP0(C0G)类陶瓷介质,介电常数约30~60,是温度稳定型电容的代表:

  • 容值温漂极小:在-55℃至+125℃范围内,容值变化≤±0.036pF(1.2pF×30ppm/℃×180℃),无明显温漂;
  • 无老化效应:长期使用容值无衰减,满足精密电路10年以上可靠性要求;
  • 低损耗特性:介质损耗远低于X7R、Y5V等温度补偿型电容,1MHz下tanδ仅0.0002,高频信号传输无能量损失。

2. 小体积高密度适配

0201封装体积仅为0.6mm×0.3mm×0.3mm,比0402封装小约60%,可显著提升PCB布局密度,适配智能手机、可穿戴设备等小型化产品。

3. 高可靠性设计

  • 端电极工艺:采用镍+锡无铅镀层(符合RoHS标准),焊接附着力强,回流焊后无脱落风险;
  • 多层叠层结构:介质层厚度均匀(≤1μm/层),耐机械应力性能优异,SMT贴装时不易开裂;
  • 湿热可靠性:在85℃/85%RH湿热环境下,1000小时后容值变化≤±1%,绝缘电阻仍≥10^11Ω。

4. 无极性安装灵活

MLCC无极性设计,无需区分正负端,可直接贴装于PCB任意焊盘,简化生产流程,降低装配错误率。

四、典型应用场景

  1. 射频(RF)电路:蓝牙5.0、WiFi 6模块的滤波、耦合、去耦电容(低损耗特性适配2.4GHz/5GHz频段信号传输);
  2. 精密模拟电路:运算放大器(运放)的相位补偿、参考电压滤波(容值稳定避免温漂导致的信号失真);
  3. 可穿戴设备:智能手环、手表的传感器信号滤波(小体积适配腕带/手表内部紧凑空间);
  4. 通信设备:基站、路由器的射频前端匹配网络(谐振频率≥10GHz适配微波频段);
  5. 工业控制电路:PLC模块的低噪声滤波(宽温范围适配-20℃~+60℃的工业环境)。

五、选型与使用注意事项

1. 容值与电压确认

  • 需根据电路需求确认容差:1.2pF典型容差±0.1pF,若需更高精度(如±0.05pF)需联系风华定制;
  • 交流应用必须降额:峰值电压≤额定直流电压的70%(即≤35V AC),避免介质击穿。

2. 焊接工艺要求

  • 回流焊:峰值温度245±5℃,保温时间≤10s,最多焊接3次(避免多次高温导致介质开裂);
  • 手工焊:烙铁温度≤350℃,焊接时间≤3s(仅适用于维修场景)。

3. 静电防护

0201封装电容对静电敏感(ESD敏感度≤2kV),生产/测试过程需:

  • 佩戴防静电手环(接地电阻≤1MΩ);
  • 使用防静电包装(防静电袋、托盘);
  • 贴装设备需配置离子风机消除静电。

4. PCB焊盘设计

焊盘尺寸建议为0.3mm×0.4mm(长×宽),焊盘间距0.2mm,避免焊盘过大导致焊接后电容偏移。

六、总结

风华0201CG1R2B500NT是一款高稳定、低损耗、小体积的MLCC,凭借C0G介质的温度稳定性和0201封装的高密度适配性,成为射频、精密模拟电路的优选元件。其符合RoHS标准的无铅设计,也适配当前电子产业的环保要求,可广泛应用于消费电子、通信、工业控制等领域,是替代进口小容量C0G电容的高性价比选择。

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