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FH 0603X475K160NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0603X475K160NT
- Type
- FH
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0603X475K160NT
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0230826954
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603X475K160NT 产品概述
一、产品简介
0603X475K160NT 为风华（FH）系列片式多层陶瓷电容（MLCC），标称容量 4.7µF，公差 ±10%，额定电压 16V，介质为 X5R。0603 封装（常用尺寸约 1.6mm × 0.8mm）适合高密度表面贴装，是在受限空间内实现较大电容值的常见选择。
二、主要电气参数
- 容值：4.7µF（标称）
- 公差：±10%
- 额定电压：16V DC
- 介质：X5R（工作温度 -55°C～+85°C，温度范围内电容变化通常在 ±15% 级别）
- 封装：0603（1608公制）
- 品牌：风华（FH）
三、性能特性与注意事项
X5R 属高介电常数陶瓷，能在小体积下实现大容量，但存在两点需注意：一是温度特性，随温度变化电容有一定偏移；二是直流偏压（DC-bias）效应明显——在接近额定电压时实际可用电容会下降，尤其在小封装高容值件上更明显。设计时应参考厂商的 DC-bias 曲线与温度曲线，避免在靠近额定值长期工作以免容量不足。
四、典型应用场景
适用于电源去耦与旁路、低频/中频滤波、稳压器输入/输出去耦、便携设备主板及通信、消费电子、工业控制等要求体积小、容量较大的场合。
五、选型与焊接建议
- 选型时优先查阅厂商数据手册的 DC-bias、寿命与可靠性测试结果；关键电源节点建议留有容量与电压裕度（常见做法 50%–80% 电压去倍率或并联更大容量件）。
- 焊接建议使用无铅回流工艺，峰值温度依数据手册推荐（典型为 245–260°C 峰值），避免多次超温循环。贴装时注意过度弯曲或机械应力，0603 尺寸对板面应力敏感。
六、可靠性与包装
风华产品一般提供卷带（tape & reel）包装，适合自动贴片加工。出货前通常通过外观、容量、绝缘电阻及耐焊接测试。重要应用建议索取并核验制造商的可靠性报告（包括温湿度、热冲击和寿命测试）。
总体而言，0603X475K160NT 在体积受限的电路中能提供较高的电容密度，适合做中低频去耦与储能，但选型和设计时需充分考虑温度与 DC-bias 导致的有效容量变化。
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