WMSIC Electronic Components

FH RC-02K6652FT

ModelRC-02K6652FT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RC-02K6652FT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-02K6652FT
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
66.5kΩ
Electronic Component
10
Electronic Component
BM0265104805
Electronic Component
±100ppm/℃
Resistor Type
Resistor
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RC-02K6652FT 厚膜贴片电阻产品概述

一、产品基本信息

RC-02K6652FT是风华电子(FH) 推出的通用型厚膜贴片电阻,采用0402封装(英制尺寸0.04×0.02英寸,公制约1.0mm×0.5mm),属于小体积高密度贴片电阻范畴。该产品通过成熟的厚膜印刷工艺制造,兼具成本优势与性能稳定性,广泛适配消费电子、工业控制、通信等领域的各类电路设计需求。

二、核心参数详解

1. 阻值与精度

产品标称阻值为66.5kΩ,阻值代码“6652”对应逻辑:665(有效数字)×10²(倍率)=66500Ω=66.5kΩ;精度等级为**±1%**,属于常规高精度范畴,可避免因阻值偏差导致的信号失真或功能异常,满足多数电路对阻值一致性的要求。

2. 功率等级

额定功率为62.5mW(即1/16W),与0402封装的尺寸特性匹配,适合低功耗电路设计。实际应用需注意功率降额(建议降额50%以上),避免过热导致阻值漂移或失效。

3. 温度系数

温度系数为**±100ppm/℃**,表示温度每变化1℃,阻值变化±0.01%(即66.5kΩ×100ppm/℃=±6.65Ω/℃)。该特性可保证产品在-55℃~125℃的宽温范围内(风华厚膜电阻典型工作温度)阻值稳定,适配环境温度波动较大的场景。

4. 封装与工艺

采用0402贴片封装,体积小、重量轻,可有效节省PCB布局空间,适配小型化设备设计趋势;工艺上采用厚膜印刷技术(陶瓷基底+电阻浆料烧结),具有成本低、一致性好、可靠性高的特点。

三、典型应用场景

RC-02K6652FT的参数特性使其适用于以下场景:

  1. 消费电子:智能手机、智能手表、蓝牙耳机等设备的信号调理(滤波、分压)、电源辅助电路;
  2. 工业控制:小型传感器模块(温度、压力传感器)的阻抗匹配、PLC辅助逻辑电路;
  3. 通信设备:基站射频前端阻抗匹配网络、光模块信号滤波电路;
  4. 汽车电子:车载低功耗传感器(胎压监测辅助电路)、信息娱乐系统信号处理;
  5. 医疗设备:小型监护仪信号调理模块、便携式医疗仪器电源电路。

四、性能优势

  1. 精度可靠:±1%精度满足工业级与消费级应用,无需额外校准即可保证电路性能;
  2. 宽温稳定:±100ppm/℃温度系数使宽温环境下阻值漂移小,适配户外或工业现场;
  3. 小体积高密度:0402封装实现PCB高密度布局,契合小型化设备设计趋势;
  4. 成本可控:厚膜工艺成熟,性价比高,适合批量生产与大规模应用;
  5. 可靠性高:经过温度循环、振动等严格测试,满足长寿命应用需求。

五、使用注意事项

  1. 功率降额:实际功率不得超过62.5mW,建议降额至30mW以内,避免过热;
  2. 焊接工艺:回流焊峰值温度≤245℃、时间≤10s,避免虚焊或热损伤;
  3. 存储条件:未焊接产品存于常温(15℃~35℃)、干燥(相对湿度≤60%)环境,防潮;
  4. 温度范围:工作温度需在-55℃~125℃内,超出可能导致阻值漂移;
  5. 阻值匹配:66.5kΩ适合分压、滤波、限流等基础电路,需根据设计需求选择。

该产品凭借稳定的性能与合理的成本,成为0402封装厚膜电阻的高性价比选型,可满足多数电子设备的基础阻抗设计需求。

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