WMSIC Electronic Components

FH 0402CG910J500NT

Model0402CG910J500NT
Package0402
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
FH 0402CG910J500NT
Type
FH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
0402CG910J500NT
Electronic Component
1
Electronic Component
91pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.022g
Electronic Component
1
Electronic Component
BM0264897114
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

风华FH 0402CG910J500NT 贴片多层陶瓷电容(MLCC)产品概述

一、产品基本信息

风华电子(FH)推出的0402CG910J500NT是一款高性能贴片多层陶瓷电容(MLCC),专为高频、高精度电路设计。产品型号命名遵循行业通用规则:

  • 0402:英制封装尺寸(对应公制1005);
  • CG:温度系数为C0G(NP0类,温度稳定性最优的陶瓷电容类别);
  • 910:容值编码(91×10⁰=91pF);
  • J:容值精度±5%;
  • 500:额定直流电压50V;
  • NT:风华内部封装/工艺标识。

该产品属于风华核心MLCC产品线,广泛适配消费电子、通信、工业等领域的中低压精密电路。

二、核心技术参数详解

2.1 容值与精度

容值为91pF,精度等级**±5%**,满足多数精密电路对电容值一致性的要求。容值采用“三位数字编码法”,前两位为有效数字,第三位为10的幂次(此规格无倍率)。

2.2 温度系数与温容特性

采用C0G(NP0)温度系数,是MLCC中温度稳定性最优的类别:

  • 温度系数范围:0±30ppm/℃(-55℃~+125℃工作区间内);
  • 温容变化率:≤±0.03%(典型值),几乎不受温度波动影响,适用于频率稳定性要求极高的场景。

2.3 额定电压与损耗

  • 额定直流电压:50V,可稳定工作在中低压电路,降额使用可进一步提升可靠性;
  • 损耗角正切(DF):≤0.15%(1kHz、25℃测试条件),低损耗特性减少高频电路能量损耗,提升信号完整性。

2.4 工作温度范围

  • 存储温度:-40℃~+85℃;
  • 工作温度:-55℃~+125℃,满足宽温环境下的稳定运行。

三、封装与尺寸规格

产品采用0402英制封装(公制1005),是小型化电路的理想选择,尺寸参数如下(典型值):

参数 英制(英寸) 公制(mm) 长度(L) 0.040±0.003 1.016±0.076 宽度(W) 0.020±0.003 0.508±0.076 厚度(T) 0.020±0.003 0.508±0.076 引脚间距(S) 0.010±0.003 0.254±0.076

封装符合IEC 60068-2-20国际标准,适配自动贴装设备(SMT),生产效率高。

四、典型应用场景

因C0G温稳性、低损耗及小体积特性,该产品广泛应用于:

  1. 通信设备:基站射频前端、路由器/交换机滤波电路、蓝牙/WiFi模块谐振匹配;
  2. 消费电子:智能手机射频天线匹配、智能穿戴设备传感器信号滤波;
  3. 工业控制:PLC模拟量输入滤波、精密仪器频率基准电路;
  4. 汽车电子:车载信息娱乐系统低功耗辅助电路(车规级衍生型号可满足AEC-Q200要求);
  5. 医疗设备:监护仪生理信号滤波、体外诊断设备精密电路。

五、产品优势与特点

  1. 超宽温度稳定性:C0G温系实现温容变化极小,避免温度波动导致电路性能漂移;
  2. 高精度一致性:±5%容值精度满足精密电路参数一致性要求;
  3. 低损耗高频适配:DF≤0.15%,减少高频信号损耗,提升射频电路性能;
  4. 小型化集成:0402封装助力终端产品轻薄化,适配高密度PCB布局;
  5. 高可靠性:风华成熟叠层工艺,无铅环保(符合RoHS 2.0),通过高温老化、温度循环等可靠性试验;
  6. 宽电压适配:50V额定电压覆盖多数中低压电路,降额使用可延长使用寿命。

六、使用注意事项

  1. 静电防护:MLCC易受静电损坏,操作时需佩戴防静电手环,使用防静电工作台;
  2. 电压降额:建议额定电压降额≥50%(实际工作电压≤25V),避免过压击穿;
  3. 焊接工艺:回流焊峰值温度≤245℃(时间≤10秒),波峰焊温度≤240℃(时间≤5秒),避免热应力损坏;
  4. 存储条件:未开封产品存储于-40℃~+85℃、湿度≤60%环境,开封后建议1个月内使用完毕;
  5. 机械应力:焊接后避免对电容施加过大压力,防止陶瓷层开裂。

该产品凭借稳定的性能与可靠的品质,成为精密电子电路设计的优选组件,可满足多数中低压高频场景的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.