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FH RC-02K512JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FH RC-02K512JT
- Type
- FH
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- RC-02K512JT
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.009g
- Electronic Component
- 5.1kΩ
- Electronic Component
- 50
- Electronic Component
- BM0258736621
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RC-02K512JT 产品概述
一、产品简介
RC-02K512JT 是风华（FH）推出的一款0402封装贴片厚膜电阻，标称阻值为5.1kΩ，阻值精度±5%，温度系数（TCR）为±100ppm/℃，额定功率62.5mW，工作温度范围为-55℃至+155℃。该系列以体积小、成本低、工艺成熟为特点，适合大批量表面贴装生产与自动化装配。
二、主要规格与性能
- 阻值：5.1kΩ（±5%）
- 封装：0402（1.0mm×0.5mm 典型尺寸）
- 功率：62.5mW（常规环境）
- 温度系数：±100ppm/℃
- 工作温度：-55℃ ~ +155℃
- 制程：厚膜（陶瓷基体上印刷阻性薄膜并烧结成型）
厚膜工艺使器件在常温和中等温度变化下具有良好的一致性和稳定性，适合普通电子应用中的分压、电阻网络和偏置元件等场合。
三、典型应用场景
- 消费类电子（手机配件、可穿戴设备、便携式终端）
- 工业控制与仪表（信号调理、分压、滤波网络）
- 通信设备（偏置网络、参考分压）
- 物联网和传感器模块（空间受限的阻值元件）
适用于对体积和成本敏感、对温漂要求在±100ppm/℃范围内可接受的场合。
四、封装与可靠性要点
0402小封装便于实现高密度布局，但在焊接和加工过程中对热量和机械应力更为敏感。推荐遵循厂家及IPC规范的焊接曲线进行回流焊，并在PCB设计时采用合适的焊盘尺寸和焊锡层，保持良好热量分布以避免局部过热。长期可靠性受环境温度、湿度与电功率密度影响，建议在高温或高功率场合采取功率降额或改用更大封装/更高额定功率产品。
五、选型与注意事项
- 功率分配：在实际电路中，应考虑环境温度与散热条件，通常建议留有功率余量，避免长期满载工作。
- 温漂需求：±100ppm/℃适合一般工业与消费环境，若对温漂要求更高（如精密仪表），建议选择薄膜或低TCR（≤25ppm/℃）产品。
- 焊接兼容性：适配标准无铅回流工艺；对焊接和清洗过程敏感时，应与PCB工艺协调。
- 存储与使用：避免长期潮湿、高盐雾与腐蚀性气体环境，必要时采取防潮包装与防护处理。
总体而言，RC-02K512JT 提供了在空间受限场合下兼顾性能与成本的可靠方案，适合大批量制造与多种常见电子应用。若有更高精度、低温漂或更大功率需求，可在风华系列中选择对应规格或咨询供应商获取替代选型建议。
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