WMSIC Electronic Components

FH RC-01W3011FT

ModelRC-01W3011FT
Package0201
BrandFH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FH RC-01W3011FT
Type
FH
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
FH
Electronic Component
RC-01W3011FT
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
3.01kΩ
Electronic Component
50
Electronic Component
BM0265601438
Operating Temperature
55℃~+125℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RC-01W3011FT 厚膜贴片电阻产品概述

RC-01W3011FT是风华电子(FH)推出的一款0201封装厚膜贴片电阻,针对高密度电路设计需求优化,兼具小型化、可靠性与基础性能适配性,广泛应用于消费电子、工业控制等领域。

一、产品基本属性

该电阻属于风华常规厚膜贴片电阻系列,核心属性明确:

  • 品牌型号:风华(FH)RC-01W3011FT;
  • 电阻类型:厚膜贴片电阻(采用厚膜印刷工艺制造,膜层附着力强);
  • 封装规格:0201封装(公制尺寸约0.6mm×0.3mm,英制对应0201);
  • 应用定位:适配信号调理、限流、分压等基础电路,满足低功耗场景的集成需求。

二、核心性能参数详解

RC-01W3011FT的关键参数界定了其应用边界,具体如下:

  1. 阻值与精度:标称阻值3.01kΩ,精度±1%(E96系列代码“3011”对应301×10¹=3010Ω,即3.01kΩ),满足多数模拟/数字电路的匹配精度要求;
  2. 功率与电压:额定功率50mW,最大工作电压25V。实际使用需通过功率公式验证(P=V²/R),避免电压过高导致过载(理论最大允许电压约12.27V,需以功率限制为准);
  3. 温度系数:±200ppm/℃,即温度每变化1℃,阻值变化±0.02%,可覆盖常规环境温度下的稳定性需求;
  4. 工作温度范围:-55℃~+125℃,符合工业级/汽车级宽温标准,适配极端温度场景。

三、设计特点与优势

  1. 小型化封装:0201封装大幅缩减PCB占用空间,适配智能手机、可穿戴设备等高密度布局设计,提升电路集成度;
  2. 厚膜工艺可靠性:风华成熟厚膜工艺确保电阻膜层均匀、附着力强,耐机械冲击与磨损,长期使用阻值漂移小;
  3. 宽场景适配:±1%精度、±200ppm/℃温系数及50mW功率,覆盖信号衰减、电源限流、分压网络等基础电路需求;
  4. 工艺兼容性:适配回流焊、波峰焊等常规贴片工艺,符合RoHS无铅环保要求,满足国内外市场准入标准。

四、典型应用场景

RC-01W3011FT因小型化与基础性能平衡,适用于以下场景:

  1. 消费电子:智能手机、平板电脑的电源管理模块(限流保护)、音频电路(信号衰减);
  2. 可穿戴设备:智能手环、手表的传感器信号调理电路(低功耗适配);
  3. 工业控制:小型PLC、传感器接口的匹配电阻(宽温范围适配工业环境);
  4. 通信设备:路由器、交换机的信号滤波网络(高密度PCB适配)。

五、环境适应性说明

  1. 温度稳定性:-55℃至+125℃宽温范围,满足高温存储(如汽车发动机舱周边)与低温户外环境需求;
  2. 湿度耐受性:符合IEC 60068-2-66标准,抗湿度变化能力强,避免吸潮导致阻值漂移;
  3. 耐腐蚀性:厚膜层采用抗氧化材料,可适配含硫等轻度腐蚀环境(具体耐腐等级可参考风华 datasheet)。

六、选型与使用注意事项

  1. 功率验证:实际功耗需≤50mW,避免过载(如电流0.01A时,功耗=0.01²×3010=0.301W,远超额定值,需严格控制);
  2. 精度匹配:若用于高精度ADC基准分压等场景,需确认温系数是否满足需求(如更高精度需选±100ppm/℃以下型号);
  3. 焊接工艺:0201封装需遵循风华推荐回流焊曲线(预热150-180℃,峰值240-260℃,时间≤10s),避免热应力损坏;
  4. 存储条件:建议存储温度-40℃~+60℃,湿度≤60%,开封后1周内使用,避免吸潮影响焊接质量。

该产品作为风华基础厚膜贴片电阻,以高性价比与可靠性满足多数常规电路需求,是小型化电子设备的理想选择。

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