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FH 0201X223K6R3NT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FH 0201X223K6R3NT
- Type
- FH
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FH
- Electronic Component
- 0201X223K6R3NT
- Electronic Component
- 1
- Electronic Component
- 22nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.008g
- Electronic Component
- 10
- Electronic Component
- BM0264866906
- Electronic Component
- X5R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201X223K6R3NT 贴片多层陶瓷电容（MLCC）产品概述
0201X223K6R3NT是风华电子（FH） 推出的一款0201封装贴片多层陶瓷电容（MLCC），针对小型化、低功耗电子设备设计，兼顾容值稳定性与体积优势，广泛应用于可穿戴、便携式消费电子等领域。以下是其核心信息梳理：
一、产品基本信息
- 品牌型号：风华电子（FH）0201X223K6R3NT
- 产品类型：贴片多层陶瓷电容（MLCC）
- 核心标识：0201（封装）+X（温度系数X5R）+223（容值代码）+K（精度）+6R3（额定电压）+NT（风华端电极/封装标识）
- 环保标准：符合RoHS、REACH无铅环保要求
二、核心参数详解
参数类别 具体指标 说明 标称容值 22nF（223代码） 前两位有效数字22，第三位倍率10³，即22×10³pF=22nF 精度 ±10%（K级） 满足常规滤波、耦合的精度需求 额定电压 6.3V（直流） 交流应用需按电压降额设计（建议≤5V） 温度系数 X5R 工作温度范围-55℃~+85℃，容值变化率±15%（比Y5V等经济型电容更稳定） 封装尺寸 0201英制（0.6mm×0.3mm） 公制对应0603（长×宽），厚度约0.3mm（典型值） 端电极 镍电极+锡镀层 兼容无铅回流焊，焊接可靠性高三、关键特性优势
小体积高集成
0201封装实现22nF容值，大幅缩小电路体积，适配TWS耳机、智能手环等紧凑设备的空间限制。温度稳定性佳
X5R介质避免了Y5V电容在高温下容值大幅下降的问题，适合户外使用的可穿戴设备（如夏季高温下的智能手表）。电气性能优异
低等效串联电阻（ESR）、低等效串联电感（ESL），适合高频信号滤波与耦合（如音频链路、传感器信号调理）。生产兼容性强
贴片封装支持SMT自动化贴装，无极性设计降低组装难度，提升量产效率。
四、典型应用场景
可穿戴电子
智能手环、手表的心率传感器/加速度传感器滤波、电源去耦；运动相机的信号链路耦合。便携式音频
TWS蓝牙耳机、无线音箱的音频信号耦合、电池供电电路去耦（如充电管理模块）。物联网终端
低功耗传感器节点（温湿度、运动传感器）的信号调理电路；智能家居遥控器的控制模块。小型消费电子
便携式充电器、移动电源的辅助滤波；智能门锁的低电压控制电路。
五、使用注意事项
电压降额
实际工作电压需低于额定6.3V（建议≤5V），避免过压导致电容击穿（尤其是脉冲电压场景）。温度限制
工作环境温度需控制在-55℃~+85℃，超出范围会导致容值漂移、可靠性下降。焊接工艺
回流焊需遵循风华推荐曲线：峰值温度230℃~240℃，回流时间≤10秒；禁止手工焊接（易损坏小封装）。机械应力
0201封装尺寸小，避免PCB弯折、机械冲击，防止陶瓷层开裂（建议PCB板厚≥0.8mm）。存储条件
常温干燥环境存储（湿度≤60%），开封后1个月内使用完毕，避免潮湿导致端电极氧化。
六、品牌与可靠性说明
风华电子是国内MLCC领域龙头企业，拥有20余年生产经验，产品通过ISO9001、IATF16949（汽车电子） 认证，批量一致性好；0201X223K6R3NT采用成熟叠层工艺，可靠性符合GB/T 26931-2011电子元件标准，适合量产需求。
该产品凭借小体积、高稳定性与成本优势，成为小型化电子设备滤波/耦合电容的常用选型之一。
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