WMSIC Electronic Components

FOJAN FRC0603F1002TS

ModelFRC0603F1002TS
Package0603
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0603F1002TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0603F1002TS
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM0261485625
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0603F1002TS 产品概述

一、产品简介

FRC0603F1002TS 是 FOJAN(富捷)推出的一款贴片厚膜电阻,封装为 0603(1608公制),阻值 10kΩ,公差 ±1%,额定功率 100mW。该器件设计用于消费电子、通信、工业控制等对体积、小功耗与可靠性有平衡要求的应用场景,温度系数为 ±100ppm/℃,工作温度范围 -55℃ 至 +155℃。

二、主要规格

  • 电阻类型:厚膜电阻
  • 阻值:10kΩ(1002 标识)
  • 精度:±1%(F)
  • 额定功率:100mW
  • 最大工作电压:75V
  • 温度系数(TCR):±100ppm/℃
  • 工作温度:-55℃ ~ +155℃
  • 封装:0603(英制)
  • 品牌:FOJAN(富捷)
  • 型号:FRC0603F1002TS

三、性能特点与优势

  • 体积小、重量轻,适合高密度贴装与尺寸受限的模块设计。
  • ±1% 精度与 ±100ppm/℃ 的温漂在多数模拟与数字电路中能提供稳定的基准与分压性能。
  • 75V 的最大工作电压满足多数低压系统中的滤波、分压与偏置应用。
  • 宽温工作范围与厚膜工艺使器件在工业级温度条件下仍能可靠工作。
  • 兼容常规表面贴装回流焊工艺,便于自动化生产线使用。

四、典型应用场景

  • 电源分压与基准电阻网络
  • 信号调理、输入限流与阻抗匹配
  • 便携设备与可穿戴电子中的通用电阻元件
  • 工业控制和通信设备中的检测、滤波电路

五、使用与焊接建议

  • 请按 PCB 压线、焊盘尺寸建议设计焊盘,避免过大或过小导致焊接缺陷或热应力集中。
  • 兼容主流回流焊工艺,但应参考富捷提供的回流曲线(峰值温度与时间)以保证焊接可靠性。
  • 在高温环境下应遵循厂方的功率降额规范,避免长期超额定功率工作引起漂移或失效。
  • 建议在电路布局时考虑热源分布,必要时为高阻值或关键网络提供散热与隔离措施。

六、可靠性与环境性能

  • 厚膜工艺在抗机械应力、耐湿热等方面表现良好,适合一般工业环境使用。
  • 推荐在实际设计认证阶段进行加速老化、焊接耐受性及温度循环测试,以验证在目标应用中的长期稳定性。
  • 满足常见的阻值稳定性与环境试验要求,具体认证与测试参数请参阅厂方技术资料。

七、包装与订购信息

  • 型号:FRC0603F1002TS;品牌:FOJAN(富捷)。
  • 常见包装形式为卷带(Tape & Reel),适配自动贴片机。
  • 订购与大批量供货可与富捷授权分销商或代理联系以获取最优包装与交付方案。

如需更详细的电气特性曲线(温漂曲线、功率降额曲线、封装尺寸公差)或焊接参数表,请提供邮箱或联系富捷客服获取官方规格书和可靠性测试报告。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.