WMSIC Electronic Components

FOJAN FRC0603F1001TS

ModelFRC0603F1001TS
Package0603
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0603F1001TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0603F1001TS
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.026g
Electronic Component
1kΩ
Electronic Component
1
Electronic Component
BM0261485664
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0603F1001TS 产品概述

一、产品简介

FRC0603F1001TS 为 FOJAN(富捷)出品的贴片厚膜电阻,封装为常用的 0603(约 1.6 mm × 0.8 mm),标称阻值 1 kΩ,公差 ±1%,额定功率 1/10W(100 mW)。该系列针对消费电子与工业类电路板上的通用分流、限流、阻抗配合与信号处理等场景,具有体积小、成本低、可靠性好等优点。

二、主要电气参数

  • 电阻类型:厚膜电阻
  • 阻值:1 kΩ
  • 精度:±1%
  • 额定功率:100 mW(1/10W)
  • 最大工作电压:75 V(工作电压为元件在额定功率条件下允许的最大电压)
  • 温度系数(TCR):±100 ppm/°C
  • 工作温度范围:-55 ℃ ~ +155 ℃

三、结构与尺寸

  • 封装:0603(国际标准封装,约 1.6 mm × 0.8 mm)
  • 引脚终端为电镀端接,便于回流焊接与波峰焊工艺。
  • 包装形式:卷带(TS 表示 Tape & Reel),便于自动贴片生产线使用。

四、性能特点

  • 精度较高(±1%),适合对阻值要求严格的模拟和数字电路。
  • 厚膜工艺成本效益高,批量一致性良好。
  • 宽温度范围与中等 TCR(±100 ppm/°C),适应多数商用与工业环境。
  • 额定电压与功率适合信号级与小功率电源电路。

五、典型应用场景

  • 移动终端、便携设备的阻值网络与限流保护。
  • 工业控制与仪表的分压/采样电路(对温漂有中等要求时)。
  • 通讯设备、消费电子的阻抗匹配、偏置网络与滤波器。
  • 自动化贴片生产线的常规通用元件。

六、选型与使用注意事项

  • 功率与散热:0603 封装受限于尺寸,实际允许功率受 PCB 散热条件影响。设计时应在额定功率下留有裕量,并对高温环境进行功率降额。
  • 温度影响:±100 ppm/°C 在大温度摆幅下会引起阻值变化,若电路对精度敏感,请评估温漂影响或考虑低 TCR 元件。
  • 额定电压:避免长期在接近 75 V 的电压下工作,防止介质击穿或电阻失效。
  • 封装兼容性:建议按 IPC 推荐的 0603 焊盘设计,确保可焊性与贴装可靠性。

七、焊接与储存建议

  • 焊接工艺:兼容表面贴装回流焊工艺,推荐参考厂商回流曲线(常规峰值温度 ≤ 260 ℃,具体以供应商资料为准)。
  • 储存与搬运:避免潮湿、高温、强腐蚀性气体环境;长期储存建议按原包装并在规定的环境条件下保存,以免端接氧化影响可焊性。

八、质量与可靠性

  • 厚膜贴片电阻为成熟的元件类型,经过常规的温度循环、湿热与负载寿命验证后可满足通用工业与消费级可靠性需求。
  • 具体的认证、寿命试验数据(如负载寿命、湿热性能)可向供应商索取器件的详细可靠性试验报告以满足高可靠性设计要求。

如需器件的完整规格书(SMD 尺寸图、回流曲线、环境与机械性能数据)或批量采购信息,可提供型号 FRC0603F1001TS 以便获取厂方原始资料与最新支持。

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