Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FOJAN FRC0402F15R0TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0402F15R0TS
- Type
- 0402
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0402F15R0TS
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.01g
- Electronic Component
- 15Ω
- Electronic Component
- 1
- Electronic Component
- BM0265306139
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0402F15R0TS 厚膜贴片电阻产品概述
一、产品基本定位与核心身份
FRC0402F15R0TS是FOJAN（富捷）品牌推出的一款小功率精密厚膜贴片电阻，采用0402封装（英制尺寸1.0mm×0.5mm），专为高密度、低功耗电路设计。作为基础无源元件，其核心身份是15Ω±1%精度的厚膜贴片电阻，兼顾成本可控与性能稳定，广泛适配消费电子、工业控制等多领域的电路需求。
二、关键性能参数全解析
该电阻的核心参数围绕“精度、功率、环境适应性”三大维度设计，具体如下：
- 阻值与精度：标称阻值15Ω，精度±1%——满足多数工业级电路对阻值偏差的要求，无需额外校准即可实现信号调理、分压等功能的稳定输出；
- 功率与电压：额定功率62.5mW，额定工作电压50V——属于低功耗电阻范畴，实际使用需遵循降额设计（通常降额至80%以下，即40V以内），确保长期可靠性；
- 温度系数：±100ppm/℃——在-55℃至+155℃的宽温范围内，阻值变化极小（计算得最大偏差约0.315Ω），远低于1%精度要求，适配温度波动场景；
- 工作温度范围：-55℃~+155℃——覆盖工业级、汽车级等恶劣环境的温度需求，无需额外散热或温度补偿。
三、封装工艺与结构特点
- 封装形式：0402贴片封装——体积小巧（1.0mm×0.5mm×0.4mm左右），无引线设计，适配SMT自动化生产，可显著提升PCB布局密度；
- 制造工艺：厚膜印刷烧结工艺——通过高精度丝网印刷将电阻浆料（如钌基浆料）沉积于氧化铝陶瓷基底，经高温烧结形成致密电阻体，再表面涂覆保护涂层，兼顾性能稳定性与批量生产一致性；
- 结构优势：陶瓷基底具有优异的热稳定性与绝缘性，厚膜电阻体抗过载、抗冲击能力强，长期使用阻值漂移小。
四、典型应用领域
结合参数特点，该电阻适用于以下场景：
- 消费电子：手机、平板、智能穿戴的电源滤波、信号分压电路，低功耗传感器节点；
- 工业控制：小型PLC模块、传感器信号调理电路（如温度、压力传感器的前端放大）；
- 汽车电子：车载辅助电路（如仪表盘背光调节、低功耗传感器接口），适配汽车级宽温环境；
- 物联网设备：低功耗网关、智能家电的控制模块，实现信号匹配与限流；
- 医疗电子：小型监护设备（如血氧仪、体温计）的信号处理电路，精度满足医疗级基础需求。
五、品牌与可靠性优势
FOJAN（富捷）作为国内专业电子元器件制造商，该电阻具备以下优势：
- 工艺一致性：厚膜工艺实现批量生产时阻值偏差、温度系数的一致性，降低电路设计的冗余成本；
- 可靠性验证：通过高温老化、湿度循环等可靠性测试，满足RoHS环保要求，适配出口市场；
- 成本优势：在保证1%精度与宽温性能的前提下，厚膜工艺比薄膜电阻成本更低，适合中大规模量产。
该产品凭借“小体积、高精度、宽温适配”的特点，成为高密度电路设计中低功耗电阻的优选方案，可有效平衡性能与成本需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
