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FUXINSEMI KMB14F
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI KMB14F
- Type
- FUXINSEMI
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- KMB14F
- Electronic Component
- 1
- Package
- MBS
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.159g
- Electronic Component
- 1
- Electronic Component
- BM0264480218
- Current
- 1A
- Current(Ir)
- 100uA
- (Vf)
- 550mV@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
KMB14F 产品概述
一、产品简介
KMB14F 是 FUXINSEMI（富芯森美）推出的一款单相整流桥堆，封装为 MBS 低剖面表面贴装结构，额定整流电流为 1.0A。器件采用硅外延芯片与金属硅结工艺，模塑塑料封装，符合无铅、RoHS 要求，适合自动化贴装与大批量生产应用。
二、主要技术参数
- 正向压降 (Vf)：约 550 mV @ IF = 1A
- 直流反向耐压 (Vr)：40 V
- 平均整流电流：1 A（可持续）
- 反向漏电流 (Ir)：100 μA（典型/最大值）
- 非重复峰值浪涌电流 (Ifsm)：30 A（单次浪涌承受能力）
- 工作结温范围：-55 ℃ ~ +150 ℃
- 类型：单相整流桥，MBS 表面贴装封装
三、主要特性
- 峰值浪涌承受能力高达 30A，具备良好抗冲击能力；
- 低正向压降设计，在 1A 工作点具有较低的功耗与发热；
- 低剖面、迷你双列/表面贴装形式，节省 PCB 空间，便于自动化焊接与替换；
- 模塑封装结构，成本低且可靠性高；
- 符合 RoHS 的无铅工艺，适用于环保要求较高的产品线。
四、典型应用
- 开关电源与线性电源整流；
- 充电器与适配器、家用电器的整流模块；
- LED 驱动、电机控制与电源管理；
- 工业控制、电源保护电路及一般电子设备的整流与反向保护。
五、封装、散热与使用建议
- 封装型号：MBS 低剖面表面贴装桥堆，建议在 PCB 布局时为管脚提供足够的铜箔面积以增强散热；
- 在连续 1A 工作或靠近最大环境温度时，应考虑器件结温升高，必要时增大散热铜量或外加散热结构；
- 焊接工艺遵循无铅回流曲线，以避免过热导致器件性能退化；
- 使用时注意反向耐压与浪涌能力匹配实际工况，合理预留安全裕度以延长寿命。
KMB14F 以其紧凑的封装、良好的浪涌承受能力与低正向压降特性，适合空间受限且对成本敏感的整流应用场景。
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